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OM13493：Surface Mount to DIP Evaluation Board OM13493

OM13493 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13493 supports the following packages: DHVQFN24 (SOT616-1), DHVQFN20 (SOT662-1), DHVQFN16 (SOT763-1) and DHVQFN14 (SOT762-1).

特性
  • Easy connection to small surface mount packages
  • Allows evaluation of device that are only available in surface mount packages
  • 100 mil center headers emulate DIP package for easy bread boarding
  • Eliminates costly sockets and custom printed circuit boards
  • Expand the kit with add-on I²C daughter cards
产品图片

Surface Mount to DIP Evaluation Board OM13493

文档资料
档案名称标题类型格式日期
UM10754OM13491, OM13492, OM13493, OM13494, OM13495, OM13496, OM13497 Breakout BoardUser manualpdf2013-10-30
订购信息
型号订购码 (12NC)可订购的器件编号产品状态
OM134939353 029 52598OM13493ULActive
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OM13493
OM13491, OM13492, OM13493, OM13494, OM13495, OM13496, OM13497 Breakout Board nvt4556
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