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OM13497:Surface Mount to DIP Evaluation Board OM13497

The OM13497 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13497 supports the following packages: VFBGA24 (SOT1199-1), XFBGA24 (SOT1342-1), HTSSOP24 (SOT1172-2).

特性
  • Easy connection to small surface mount packages
  • Allows evaluation of device that are only available in surface mount packages
  • 100 mil center headers emulate DIP package for easy bread boarding
  • Eliminates costly sockets and custom printed circuit boards
  • Expand the kit with add-on I²C daughter cards
产品图片

Surface Mount to DIP Evaluation Board OM13497

文档资料
档案名称标题类型格式日期
UM10754OM13491, OM13492, OM13493, OM13494, OM13495, OM13496, OM13497 Breakout BoardUser manualpdf2013-10-30
订购信息
型号订购码 (12NC)可订购的器件编号产品状态
OM134979353 029 55598OM13497ULActive
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OM13497
OM13491, OM13492, OM13493, OM13494, OM13495, OM13496, OM13497 Breakout Board nvt4556