PBHV9040Z: 500 V,0.25 A PNP高压低VCEsat (BISS)晶体管

PNP高压低VCEsat突破性小信号(BISS)晶体管,采用SOT223 (SC-73)中等功率表面贴装器件(SMD)塑料封装。NPN补充产品:PBHV8540Z。

PBHV9040Z: 产品结构框图
PBHV9040Z: 应用结构框图
SOT223
数据手册 (1)
名称/描述Modified Date
500 V, 0.25 A PNP high-voltage low VCEsat (BISS) transistor (REV 2.0) PDF (131.0 kB) PBHV9040Z [English]23 Jan 2009
应用说明 (1)
名称/描述Modified Date
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English]12 Jul 2011
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English]08 Feb 2016
包装 (2)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English]07 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PBHV9040Z NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBHV9040Z_1 [English]31 Jan 2015
PBHV9040Z NXP Product Quality (REV 1.2) PDF (74.0 kB) PBHV9040Z_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)transistor polarityTransistor polarityPolarityPtot [max] (mW)VCEO [max] (V)IC [max] (A)ICM [max] (A)hFE [min]hFE [typ]fT [typ] (MHz)RCEsat [typ] (mΩ)VCEsat [max] (mV)
PBHV9040Z/ZLActiveSOT223SC-736.5 x 3.5 x 1.65PNP700-400-0.25-0.510020055-200
PBHV9040ZActiveSOT223SC-736.5 x 3.5 x 1.65PNPPNP700-400-0.25-0.510020055-200
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PBHV9040ZSOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActivePBHV9040Z,115 (9340 614 09115)V9040ZPBHV9040ZAlways Pb-free153.00.711.41E911
PBHV9040Z/ZLSOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActivePBHV9040Z/ZLF (9340 707 64135)Standard MarkingPBHV9040Z/ZL153.00.711.41E9
Reel 7" Q1/T1ActivePBHV9040Z/ZLX (9340 707 64115)Standard MarkingPBHV9040Z/ZL153.00.711.41E9
500 V, 0.25 A PNP high-voltage low VCEsat (BISS) transistor PBHV9040Z
Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
PBHV9040Z NXP® Product Reliability PBHV9040Z
PBHV9040Z NXP Product Quality PBHV9040Z
PBHV9040Z SPICE model PBHV9040Z
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
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