PBSS3515MB: 15 V,0.5 A PNP低VCEsat (BISS)晶体管

PNP低VCEsat突破性小信号(BISS)晶体管,采用无引脚超小型SOT883B表面贴装器件(SMD)塑料封装。NPN补充产品:PBSS2515MB。

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数据手册 (1)
名称/描述Modified Date
15 V, 0.5 A PNP low VCEsat (BISS) transistor (REV 1.0) PDF (526.0 kB) PBSS3515MB [English]08 Mar 2012
应用说明 (2)
名称/描述Modified Date
Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors (REV 3.0) PDF (1.3 MB) AN11045 [English]04 Mar 2013
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English]12 Jul 2011
封装信息 (1)
名称/描述Modified Date
DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm (REV 1.0) PDF (181.0 kB) SOT883B [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... (REV 1.0) PDF (206.0 kB) SOT883B_315 [English]22 Jul 2016
可靠性与质量信息 (2)
名称/描述Modified Date
PBSS3515MB NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS3515MB_1 [English]31 Jan 2015
PBSS3515MB NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS3515MB_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)transistor polarityTransistor polaritynumber of transistorsPtot [max] (mW)VCEO [max] (V)IC [max] (A)ICM [max] (A)hFE [min]hFE [typ]fT [min] (MHz)fT [typ] (MHz)RCEsat [typ] (mΩ)VCEsat [max] (mV)RCEsat [max] (mΩ)
PBSS3515MBActiveSOT883BDFN1006B-31 x 0.6 x 0.37PNP1250-15-0.5-1200100280-25500
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PBSS3515MBSOT883BReflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActivePBSS3515MB,315 (9340 658 77315)0001 0011PBSS3515MBAlways Pb-free153.00.711.41E911
15 V, 0.5 A PNP low VCEsat (BISS) transistor PBSS3515MB
Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors PBSS4041SPN
Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
PBSS3515MB NXP® Product Reliability PBSS3515MB
PBSS3515MB NXP Product Quality PBSS3515MB
PBSS3515MB SPICE model PBSS3515MB
DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm BC857BMB
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... BC857BMB
PMZB950UPE