PBSS5230T: 30 V，2 A PNP低VCEsat (BISS)晶体管
PNP低VCEsat突破性小信号(BISS)晶体管，采用SOT23小型表面贴装器件(SMD)塑料封装。NPN补充产品：PBSS4230T。
SOT023
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 30 V, 2 A PNP low VCEsat (BISS) transistor (REV 2.0) PDF (210.0 kB) PBSS5230T [English] | 14 Jun 2012 |
应用说明 (1)
| 名称/描述 | Modified Date |
|---|---|
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English] | 12 Jul 2011 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English] | 16 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| PBSS5230T NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS5230T_1 [English] | 31 Jan 2015 |
| PBSS5230T NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS5230T_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- PBSS5230T SPICE model (REV 1.4) prm PBSS5230T_1_2 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | Transistor polarity | transistor polarity | Ptot [max] (mW) | number of transistors | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [typ] (MHz) | fT [min] (MHz) | RCEsat [typ] (mΩ) | VCEsat [max] (mV) | RCEsat [max] (mΩ) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS5230T/ZL | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | PNP | 300 | -30 | -2 | -3 | 300 | 450 | 200 | 160 | -110 | ||||
| PBSS5230T | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | PNP | 300 | 1 | -30 | -2 | -3 | 300 | 450 | 200 | 100 | 160 | -110 | 220 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS5230T | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | PBSS5230T,215 (9340 579 91215) | %3G | PBSS5230T |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| PBSS5230T/ZL | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | PBSS5230T/ZLR (9340 690 47215) | Standard Marking | PBSS5230T/ZL | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- PBSS5230T NXP® Product Reliability PBSS5230T
- PBSS5230T NXP Product Quality PBSS5230T
- PBSS5230T SPICE model PBSS5230T
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- PMBFJ309
