PBSS8110T: 100 V、1 A NPN低VCEsat (BISS)晶体管
NPN低VCEsat晶体管，采用SOT23塑料封装。
PNP补充：PBSS9110T。
PBSS8110T: 产品结构框图
SOT023
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 100 V, 1 A NPN low VCEsat (BISS) transistor (REV 2.0) PDF (196.0 kB) PBSS8110T [English] | 22 Dec 2003 |
应用说明 (2)
| 名称/描述 | Modified Date |
|---|---|
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English] | 12 Jul 2011 |
| Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 [English] | 06 Jan 2006 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 [English] | 05 Feb 2013 |
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English] | 16 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| PBSS8110T NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS8110T_1 [English] | 31 Jan 2015 |
| PBSS8110T NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS8110T_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- PBSS8110T SPICE model (REV 1.4) prm PBSS8110T_1_2 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | Transistor polarity | transistor polarity | Ptot [max] (mW) | number of transistors | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [min] (MHz) | fT [typ] (MHz) | RCEsat [typ] (mΩ) | VCEsat [max] (mV) | RCEsat [max] (mΩ) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS8110T | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | NPN | 300 | 1 | 100 | 1 | 3 | 150 | 100 | 165 | 200 | 200 | |||
| PBSS8110T/DG | No Longer Manufactured | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | NPN | 300 | 100 | 1 | 3 | 150 | 165 | 200 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS8110T | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | PBSS8110T,215 (9340 576 72215) | %U8 | PBSS8110T |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 11" Q3/T4, LargePack | Active | PBSS8110TVL (9340 576 72235) | %U8 | PBSS8110T | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
- PBSS8110T NXP® Product Reliability PBSS8110T
- PBSS8110T NXP Product Quality PBSS8110T
- PBSS8110T SPICE model PBSS8110T
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
- PMMT491A
- PMBFJ309
