PDTC123JMB:NPN配电阻晶体管;R1 = 2.2 kΩ,R2 = 47 kΩ

NPN配电阻晶体管(RET),采用无引脚超小型DFN1006B-3 (SOT883B)表面贴装器件(SMD)塑料封装。PNP补充产品:PDTA123JMB。

特性和优势
    • 100 mA的输出电流能力
    • 元器件数量更少
    • 内置偏置电阻
    • 贴片成本更低
    • 电路设计更为简化
    • 符合AEC-Q101标准
    • 无引脚超小型SMD塑料封装
    • 0.37mm的低封装高度
应用
    • 低电流外设驱动器
    • 控制IC输入
    • 可在数字应用中替代通用晶体管
    • 移动应用
产品图片
关键参数
SymbolParameterConditionsMinTyp/NomMaxUnit
VCEOcollector-emitter voltageopen base50V
IOoutput current100mA
R1resistance 1Tamb = 25 °C1.542.22.86
R2/R1resistance ratioTamb = 25 °C172126 
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
PDTC123JMB
DFN1006B-3
(SOT883B)
sot883b_poReflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mm量产0001 0111PDTC123JMB,315( 9340 658 82315 )
引脚配置信息
PinSymbolDescription外形简图图形符号
1Iinput (base)
2GGND (emitter)
3Ooutput (collector)
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期EFRIFR (FIT)MTBF(小时)潮湿敏感度等级MSL LF
PDTC123JMBPDTC123JMB,315Always Pb-free143.00.661.52E911
文档资料
档案名称标题类型格式日期
PDTC123JMB (中文)NPN resistor-equipped transistor; R1 = 2.2 kOhm, R2 = 47 kOhmData sheetpdf2012-05-22
PDTC123JMB_NXP_Product_QualityPDTC123JMB NXP Product QualityQuality documentpdf2015-01-31
PDTC123JMB_NXP_Product_ReliabilityPDTC123JMB NXP Product ReliabilityQuality documentpdf2015-01-31
PDTC123JMBPDTC123JMB SPICE modelSPICE modelprm2012-07-22
Reflow_Soldering_ProfileReflow Soldering ProfileReflow solderingpdf2013-09-30
sot883b_poLeadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mmOutline drawingpdf2011-08-23
订购信息
型号订购码 (12NC)可订购的器件编号
PDTC123JMB9340 658 82315PDTC123JMB,315
模型
标题类型日期
PDTC123JMB SPICE modelSPICE model2012-07-22
NPN resistor-equipped transistor; R1 = 2.2 kOhm, R2 = 47 kOhm PDTC123JMB
PDTC123JMB NXP Product Quality PDTC123JMB
PDTC123JMB NXP Product Reliability PDTC123JMB
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm PMZB950UPE
PDTC123JMB SPICE model PDTC123JMB