PDTC123YMB：NPN配电阻晶体管；R1 = 2.2 kΩ，R2 = 10 kΩ
NPN配电阻晶体管(RET)，采用无引脚超小型DFN1006B-3 (SOT883B)表面贴装器件(SMD)塑料封装。PNP补充产品：PDTA123YMB。
特性和优势
应用
| 产品图片 |
关键参数
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| VCEO | collector-emitter voltage | open base | 50 | V | ||
| IO | output current | 100 | mA | |||
| R1 | resistance 1 | Tamb = 25 °C | 1.54 | 2.2 | 2.86 | kΩ |
| R2/R1 | resistance ratio | Tamb = 25 °C | 3.6 | 4.5 | 5.5 |
封装与包装
| 型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
|---|---|---|---|---|---|---|---|
| PDTC123YMB |  DFN1006B-3 (SOT883B) | sot883b_po | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | 量产 | 0011 0110 | PDTC123YMB,315( 9340 659 47315 ) |
引脚配置信息
| Pin | Symbol | Description | 外形简图 | 图形符号 |
|---|---|---|---|---|
| 1 | I | input (base) |  |  |
| 2 | G | GND (emitter) | ||
| 3 | O | output (collector) |
无铅环保信息
| 型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | EFR | IFR (FIT) | MTBF（小时） | 潮湿敏感度等级 | MSL LF |
|---|---|---|---|---|---|---|---|---|
| PDTC123YMB | PDTC123YMB,315 |   | Always Pb-free | 143.0 | 0.66 | 1.52E9 | 1 | 1 |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| PDTC123YMB (中文) | NPN resistor-equipped transistor; R1 = 2.2 kOhm, R2 = 10 kOhm | Data sheet | 2012-06-21 | |
| PDTC123YMB_NXP_Product_Quality | PDTC123YMB NXP Product Quality | Quality document | 2015-01-31 | |
| PDTC123YMB_NXP_Product_Reliability | PDTC123YMB NXP Product Reliability | Quality document | 2015-01-31 | |
| PDTC123YMB | PDTC123YMB SPICE model | SPICE model | prm | 2012-07-22 |
| Reflow_Soldering_Profile | Reflow Soldering Profile | Reflow soldering | 2013-09-30 | |
| sot883b_po | Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm | Outline drawing | 2011-08-23 |
订购信息
| 型号 | 订购码 (12NC) | 可订购的器件编号 |
|---|---|---|
| PDTC123YMB | 9340 659 47315 | PDTC123YMB,315 |
模型
| 标题 | 类型 | 日期 |
|---|---|---|
| PDTC123YMB SPICE model | SPICE model | 2012-07-22 |
- PDTC123YMB NXP Product Quality PDTC123YMB
- PDTC123YMB NXP Product Reliability PDTC123YMB
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm PMZB950UPE
- PDTC123YMB SPICE model PDTC123YMB
