PMCXB900UE: 20 V，互补N/P沟道Trench MOSFET
N/P沟道互补增强型场效应晶体管(FET)，采用使用Trench MOSFET技术的无引脚超小型DFN1010B-6 (SOT1216)表面贴装器件(SMD)塑料封装。
sot1216_3d
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 20 V, complementary N/P-channel Trench MOSFET (REV 2.0) PDF (315.0 kB) PMCXB900UE [English] | 30 Jun 2015 |
应用说明 (7)
| 名称/描述 | Modified Date |
|---|---|
| Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 [English] | 13 Jul 2016 |
| Power MOSFET single-shot and repetitive avalanche ruggedness rating (REV 3.0) PDF (146.0 kB) AN10273 [English] | 10 Dec 2015 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH [English] | 22 May 2014 |
| Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 [English] | 19 May 2014 |
| LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH [English] | 14 Sep 2012 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 [English] | 16 Nov 2011 |
| LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 [English] | 27 Jan 2011 |
手册 (3)
| 名称/描述 | Modified Date |
|---|---|
| NXP® MOSFETs and bipolar transistors in DFN1010; Small and Powerful (REV 1.0) PDF (1.8 MB) 75017485 [English] | 04 Nov 2013 |
| 适用于便携设备和移动电话... (REV 1.0) PDF (4.9 MB) 939775017444_ZH [English] | 28 Oct 2013 |
| Discretes for portable devices and mobile handsets (REV 1.1) PDF (3.9 MB) 939775017444 [English] | 04 Sep 2013 |
选型工具指南 (2)
| 名称/描述 | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
| NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590 [English] | 11 Sep 2014 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| DFN1010B-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals (REV 1.0) PDF (199.0 kB) SOT1216 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| DFN1010B-6; Reel pack, SMD, 7" Q2/T3 Turned 90 degree product orientation Orderable part number ending, 147 or... (REV 1.0) PDF (202.0 kB) SOT1216_147 [English] | 06 Oct 2015 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| PMCXB900UE NXP® Product Reliability (REV 1.1) PDF (84.0 kB) PMCXB900UE_1 [English] | 31 Jan 2015 |
| PMCXB900UE NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMCXB900UE_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Power MOSFET frequently asked questions and answers (REV 1.0) PDF (1.1 MB) TN00008 [English] | 07 Aug 2015 |
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- PMCXB900UE Spice model (REV 1.0) ZIP PMCXB900UE_12_12_2012 12/13/2013
订购信息
| 型号 | 状态 | Package version | Package name | Channel type | Number of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 5 V (mΩ) | RDSon [max] @ VGS = 4.5 V (mΩ) | RDSon [max] @ VGS = 2.5 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | VGSth [typ] (V) | Qr [typ] (nC) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | 日期 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMCXB900UE | Active | SOT1216 | DFN1010B-6 | N/P | 2 | 20 | 620 | 850 | 150 | 0.6 | 0.1 | 0.4 | 0.4 | 0.265 | 0.7 | N | 21.3 | 5.4 | 2013-10-07 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMCXB900UE | | SOT1216 | Reflow_Soldering_Profile | Reel 7" Q2/T3 | Active | PMCXB900UEZ (9340 671 43147) | 10/n00/n00 | PMCXB900UE |    | Always Pb-free | 234.0 | 1.08 | 9.26E8 | 1 | 1 |
| Reel 7" Q1/T1 | Withdrawn | PMCXB900UEX (9340 671 43115) | 10/n00/n00 | PMCXB900UE | | Always Pb-free | 234.0 | 1.08 | 9.26E8 | 1 |
- Using power MOSFETs in parallel BUK7M12-60E
- Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E
- LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E
- Using RC Thermal Models BUK7M12-60E
- LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E
- LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E
- LFPAK MOSFET thermal design guide BUK7M12-60E
- NXP® MOSFETs and bipolar transistors in DFN1010; Small and Powerful PBSS5260QA
- 适用于便携设备和移动电话... ptvsxs1ur_automotive
- Discretes for portable devices and mobile handsets ptvsxs1ur_automotive
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW
- PMCXB900UE NXP® Product Reliability PMCXB900UE
- PMCXB900UE NXP® Product Quality PMCXB900UE
- Power MOSFET frequently asked questions and answers BUK7M12-60E
- PMCXB900UE Spice model PMCXB900UE
- DFN1010B-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals BC857QAS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- DFN1010B-6; Reel pack, SMD, 7" Q2/T3 Turned 90 degree product orientation Orderable part number ending, 147 or... BC857QAS
- LOW_RDSON_MOSFETS_IN_ULTRA_SMALL_DFN1010_SINGLE_AND_DUAL_PACKAGE
