PMEG3030BEP: 3 A低V_F MEGA肖特基势垒整流二极管
平面高能效通用型(MEGA)肖特基势垒整流器，带集成应力保护环，采用SOD128小型扁平引脚表面贴装设备（SMD）塑料封装。
sod128_3d
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 3 A low V_F MEGA Schottky barrier rectifier (REV 1.0) PDF (93.0 kB) PMEG3030BEP [English] | 09 Nov 2009 |
应用说明 (1)
| 名称/描述 | Modified Date |
|---|---|
| Thermal consideration of NXP® FlatPower MEGA Schottky barrier rectifiers - Selection criteria (REV 3.0) PDF (180.0 kB) AN10808 [English] | 29 Apr 2015 |
手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| NXP® low VF (MEGA) Schottky rectifiers in CFP3 and CFP5 FlatPower packages (REV 1.0) PDF (986.0 kB) 75017640 [English] | 20 Feb 2015 |
选型工具指南 (1)
| 名称/描述 | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 2 leads (REV 1.0) PDF (178.0 kB) SOD128 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| Reel pack, SMD, 7" T1 standard product orientation Ordering code (12NC) ending 115 (REV 1.0) PDF (140.0 kB) SOD128_115 [English] | 27 Mar 2014 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| PMEG3030BEP NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG3030BEP_1 [English] | 31 Jan 2015 |
| PMEG3030BEP NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG3030BEP_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
支持信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- PMEG3030BEP SPICE model (REV 1.4) prm PMEG3030BEP_1_2 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | IF (A) | VR (V) | Configuration | IR [max] (mA) | IFSM [max] (A) | Cd [max] (pF) | VF [max] (mV) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG3030BEP | Active | SOD128 | SOD128 | 3.8 x 2.5 x 1 | 3 | 30 | single | 0,15@VR=30V | 50 | 170@VR=10V | 450@IF=3A |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG3030BEP | | SOD128 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PMEG3030BEP,115 (9340 614 76115) | A6 | PMEG3030BEP |   | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
- 3 A low V_F MEGA Schottky barrier rectifier PMEG3030BEP
- Thermal consideration of NXP® FlatPower MEGA Schottky barrier rectifiers - Selection criteria PMEG6045ETP
- NXP® low VF (MEGA) Schottky rectifiers in CFP3 and CFP5 FlatPower packages SOD123W_SOD128_AUTOMOTIVE
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- PMEG3030BEP NXP® Product Reliability PMEG3030BEP
- PMEG3030BEP NXP® Product Quality PMEG3030BEP
- PMEG3030BEP SPICE model PMEG3030BEP
- plastic surface-mounted package; 2 leads ptvsxp1up_automotive
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reel pack, SMD, 7" T1 standard product orientation Ordering code (12NC) ending 115 ptvsxp1up_automotive
- PTVSXP1UTP_SERIES
