PMN70XPE: 20 V，单P沟道Trench MOSFET
P沟道增强型场效应晶体管(FET)，采用使用Trench MOSFET技术的小型SOT457 (SC-74)表面贴装器件(SMD)塑料封装。
SOT457
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 20 V, single P-channel Trench MOSFET (REV 1.0) PDF (203.0 kB) PMN70XPE [English] | 06 Jul 2012 |
应用说明 (10)
| 名称/描述 | Modified Date |
|---|---|
| Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 [English] | 13 Jul 2016 |
| Power MOSFET single-shot and repetitive avalanche ruggedness rating (REV 3.0) PDF (146.0 kB) AN10273 [English] | 10 Dec 2015 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH [English] | 22 May 2014 |
| Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 [English] | 19 May 2014 |
| Understanding power MOSFET data sheet parameters (REV 4.0) PDF (571.0 kB) AN11158 [English] | 04 Feb 2014 |
| Understanding power MOSFET data sheet parameters (REV 3.0) PDF (903.0 kB) AN11158_ZH [English] | 08 Nov 2013 |
| Failure signature of Electrical Overstress on Power MOSFETs (REV 1.0) PDF (10.5 MB) AN11243 [English] | 29 Oct 2012 |
| LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH [English] | 14 Sep 2012 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 [English] | 16 Nov 2011 |
| LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 [English] | 27 Jan 2011 |
选型工具指南 (2)
| 名称/描述 | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
| NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590 [English] | 11 Sep 2014 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 [English] | 30 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| PMN70XPE NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMN70XPE_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| PMN70XPE NXP® Product Reliability (REV 1.1) PDF (84.0 kB) PMN70XPE_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (4)
| 名称/描述 | Modified Date |
|---|---|
| Power MOSFET frequently asked questions and answers (REV 1.0) PDF (1.1 MB) TN00008 [English] | 07 Aug 2015 |
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English] | 03 Jun 2013 |
SPICE
- PMN70XPE Spice model (REV 1.0) lib PMN70XPE_31_05_2012 12/13/2013
订购信息
| 型号 | 状态 | Package name | Package version | Channel type | Number of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 5 V (mΩ) | RDSon [max] @ VGS = 4.5 V (mΩ) | RDSon [max] @ VGS = 2.5 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | QG(tot) [typ] (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | 日期 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMN70XPE | Active | TSOP6 | SOT457 | P | 1 | -20 | 85 | 129 | 150 | -4.1 | 1.3 | 5.2 | 5.2 | 0.5 | -1 | N | 602 | 101 | 2012-07-10 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMN70XPE | | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | PMN70XPE,115 (9340 668 49115) | WF | PMN70XPE |    | Always Pb-free | 234.0 | 1.08 | 9.26E8 | 1 | 1 |
- 20 V, single P-channel Trench MOSFET PMN70XPE
- Using power MOSFETs in parallel BUK7M12-60E
- Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E
- LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E
- Using RC Thermal Models BUK7M12-60E
- Understanding power MOSFET data sheet parameters BUK7M12-60E
- Understanding power MOSFET data sheet parameters BUK7K6R8-40E
- Failure signature of Electrical Overstress on Power MOSFETs BUK7M12-60E
- LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E
- LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E
- LFPAK MOSFET thermal design guide BUK7M12-60E
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW
- PMN70XPE NXP® Product Quality PMN70XPE
- PMN70XPE NXP® Product Reliability PMN70XPE
- Power MOSFET frequently asked questions and answers BUK7M12-60E
- MAR_SOT457 Topmark 74LVC2G17_Q100
- PMN70XPE Spice model PMN70XPE
- plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
- SSL5021_SSL5031
