SC18IS602BIPW：I2C总线至SPI桥
SC18IS602B用作微控制器标准I²C总线和SPI总线之间的接口。允许微控制器通过其I²C总线与SPI器件直接通信。SC18IS602B用作I²C总线从发送器或从接收器以及SPI主器件。SC18IS602B控制所有SPI总线特定序列、协议、仲裁和定时。SC18IS602B拥有自己的内部振荡器，支持四个SPI芯片选择输出，可在不使用时配置为GPIO。
特性和优势
应用
| 产品图片 |
封装与包装
| 型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
|---|---|---|---|---|---|---|---|
| SC18IS602BIPW |  TSSOP16 (SOT403-1) | sot403-1_po | sot403-1_fr SSOP-TSSOP-VSO-WAVE | Reel 13" Q2/T3 | 量产 | IS602B | SC18IS602BIPW,128( 9352 861 82128 ) |
| Bulk Pack | 量产 | IS602B | SC18IS602BIPW,112( 9352 861 82112 ) |
无铅环保信息
| 型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
|---|---|---|---|---|---|
| SC18IS602BIPW | SC18IS602BIPW,128 |   | Always Pb-free | 1 | 1 |
| SC18IS602BIPW | SC18IS602BIPW,112 | | Always Pb-free | 1 | 1 |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| SC18IS602B (中文) | I2C-bus to SPI bridge | Data sheet | 2015-02-11 | |
| 75017552 | NXP High-speed UARTs and Bridge ICs | Brochure | 2014-04-03 | |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 | |
| SOT403-1_128 | TSSOP16; Reel pack; SMD, 13", Turned Q4/T2 180 deg product orientation Orderable part number ending ,128 or HP Ordering code (12NC) ending 128 | Packing | 2014-10-14 | |
| sot403-1_fr | Footprint for reflow soldering SOT403-1 | Reflow soldering | 2009-10-08 | |
| sot403-1_po | plastic thin shrink small outline package; 16 leads; body width 4.4 mm | Outline drawing | 2009-10-08 |
订购信息
| 型号 | 订购码 (12NC) | 可订购的器件编号 |
|---|---|---|
| SC18IS602BIPW | 9352 861 82128 | SC18IS602BIPW,128 |
| SC18IS602BIPW | 9352 861 82112 | SC18IS602BIPW,112 |
- I2C-bus to SPI bridge sc18is602bipw
- NXP® High-speed UARTs and Bridge ICs SC28L92
- SSOP-TSSOP-VSO-WAVE LPC1114FDH28
- TSSOP16; Reel pack; SMD, 13", Turned Q4/T2 180 deg product orientation Orderable part number ending ,128 or HP ... sc18im700ipw
- Footprint for reflow soldering SOT403-1 PCA9633
- plastic thin shrink small outline package; 16 leads; body width 4.4 mm PCA9633
