TFF11070HN：适合VSAT应用的低相位噪声本振发生器
频率发生器设计用于低相位噪声本振(LO)电路。
特性和优势
应用
| 产品图片 |
关键参数
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| fi(RF) | RF input frequency | 27 | 450 | MHz | ||
| Pi(ref) | reference input power | -10 | 0 | dBm | ||
| VCC | supply voltage | 3 | 3.3 | 3.6 | V | |
| ICC | supply current | Vsup = 3.3 V | 100 | 130 | mA | |
| fo(RF) | RF output frequency | 6.8 | 7.2 | GHz | ||
| φnλ(synth) | synthesizer phase noise density | foffset = 100 kHz | -97 | -92 | dB/Hz | |
| φnλ(VCO) | VCO phase noise density | foffset = 10 MHz | -130 | dB/Hz | ||
| Po(RF) | RF output power | measured single ended [0] | -7 | -5 | -3 | dBm |
| RLout | output return loss | measured at demo board and de-embedded to footprint; |ΖS| = 50 Ω; |ΖL| = 50 Ω | -10 | dB |
封装与包装
| 型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
|---|---|---|---|---|---|---|---|
| TFF11070HN/N1 |  HVQFN24 (SOT616-1) | sot616-1_po | sot616-1_fr | Reel 13" Q1/T1 | 开发中 | Standard Marking | TFF11070HN/N1,118( 9352 892 73118 ) |
引脚配置信息
| Pin | Symbol | Description | 外形简图 | 图形符号 |
|---|---|---|---|---|
| 1 | VREGVCO | Regulated output voltage for VCO loop filter. Connect loop filter to this pin. |  |  |
| 2 | CPOUT | Charge pump output. | ||
| 3 | VTUNE | Tuning voltage for VCO. | ||
| 4 | NSL0 | Divider setting, LSB. Leave open for “1”, connect to GND for “0”. | ||
| 5 | NSL1 | Divider setting. Leave open for “1”, connect to GND for “0”. | ||
| 6 | NSL2 | Divider setting, MSB. Leave open for “1”, connect to GND for “0”. | ||
| 7 | LCKDET | Lock detect. Lock = 2.5 V; out of lock = 0 V. | ||
| 8 | GND1(REF) | Ground for REF input. Connect this pin to the exposed diepad landing. | ||
| 9 | IN(REF)_P | Reference signal, non-inverting input. Couple this AC to the source. | ||
| 10 | IN(REF)_N | Reference signal, inverting input. Couple this AC to the source. | ||
| 11 | GND2(REF) | Ground for REF input. Connect this pin to the exposed diepad landing. | ||
| 12 | VCC(REF) | Supply of the internal regulated voltages. Decouple this pin against GND2(REF) (pin 11). | ||
| 13 | VCC(DIV) | Supply of the divider and PFD/CP. Decouple this pin against GND(DIV) (pin 14) | ||
| 14 | GND(DIV) | Ground of the divider. Connect this pin to the exposed diepad landing. | ||
| 15 | n.c. | not connected. | ||
| 16 | n.c. | not connected. | ||
| 17 | GND1(BUF) | Ground for RF output. Connect this pin to the exposed diepad landing. | ||
| 18 | VCC(BUF) | Supply voltage for the RF output buffer. Decouple this pin against GND2(BUF) pin (19) | ||
| 19 | GND2(BUF) | Ground for RF output. Connect this pin to the exposed diepad landing. | ||
| 20 | BUF1_N | RF output. | ||
| 21 | BUF2_N | RF output. | ||
| 22 | BUF1_P | RF output. | ||
| 23 | BUF2_P | RF output. | ||
| 24 | GND3(BUF) | Ground for RF output. Connect this pin to the exposed diepad landing. |
无铅环保信息
| 型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
|---|---|---|---|---|---|
| TFF11070HN/N1 | TFF11070HN/N1,118 |   | Always Pb-free | 1 | 1 |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| 75017347 | Enabling the Mobile Experience | Brochure | 2013-02-05 | |
| PllApplet_2008-03-11 | LO PLL calculator | Other type | zip | 2008-11-03 |
| UM10484 | Integrated clean-up-PLL, TFF1xxxx and buffer amplifier | User manual | 2012-10-22 | |
| SOT616-1_118 | HVQFN24; reel pack; standard product orientation; 12NC ending 118 | Packing | 2014-01-16 | |
| sot616-1_po | plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm | Outline drawing | 2002-10-21 | |
| sot616-1_fr | Footprint for reflow soldering SOT616-1 | Reflow soldering | 2009-10-08 |
订购信息
| 型号 | 订购码 (12NC) | 可订购的器件编号 |
|---|---|---|
| TFF11070HN/N1 | 9352 892 73118 | TFF11070HN/N1,118 |
- Enabling the Mobile Experience rf
- PllApplet_2008-03-11_1 TFF1007HN
- Integrated clean-up-PLL, TFF1xxxx and buffer amplifier TFF1007HN
- HVQFN24; reel pack; standard product orientation; 12NC ending 118 TFF1007HN
- plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm TFF11152HN
- Footprint for reflow soldering SOT616-1 TFF11152HN
