MC100EL33: 5.0 V ECL ÷·4 Divider

The MC10EL/100EL33 is an integrated ÷4 divider. The differential clock inputs and the VBB allow a differential, single-ended or AC coupled interface to the device. If used, the VBB output should be bypassed to ground with a 0.015F capacitor. Also note that the VBB is designed to be used as an input bias on the EL33 only, the VBB output has limited current sink and source capability. The reset pin is asynchronous and is asserted on the rising edge. Upon power-up, the internal flip-flops will attain a random state; the reset allows for the synchronization of multiple EL33's in a system.The 100 Series contains temperature compensation.

特性
  • 650ps Propagation Delay
  • 4.0GHz Toggle Frequency
  • ESD Protection: > 1 KV HBM, > 100 V MM
  • PECL Mode Operating Range: VCC= 4.2 V to 5.7 V with VEE= 0 V
  • NECL Mode Operating Range: VCC= 0 V with VEE= -4.2 V to -5.7 V
  • Internal Input Pulldown Resistors on CLK(s) and R.
  • Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
  • Moisture Sensitivity Level 1For Additional Information, see Application Note AND8003/D
  • Flammability Rating: UL-94 code V-0 @ 1/8", Oxygen Index 28 to 34
  • Transistor Count = 95 devices
  • Pb-Free Packages are Available
应用注释 (17)
Document TitleDocument ID/SizeRevisionRevision Date
AC Characteristics of ECL DevicesAND8090/D (896.0kB)1
Clock Generation and Clock and Data Marking and Ordering Information GuideAND8002/D (71kB)12
Clock Management Design Using Low Skew and Low Jitter DevicesTND301/D (205.0kB)0
Designing with PECL (ECL at +5.0 V)AN1406/D (105.0kB)2
ECL Clock Distribution TechniquesAN1405/D (54.0kB)1
ECLinPS and ECLinPS Lite SPICE I/O Modeling KitAN1503/D (120.0kB)6
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information GuideAND8002 (71kB)12
Interfacing Between LVDS and ECLAN1568/D (121.0kB)11
Interfacing with ECLinPSAND8066/D (72kB)3
Metastability and the ECLinPS FamilyAN1504/D (103.0kB)3
Odd Number Divide By Counters with 50% Outputs and Synchronous ClocksAND8001/D (90.0kB)0
Phase Lock Loop General OperationsAND8040/D (64.0kB)3
Storage and Handling of Drypack Surface Mount DeviceAND8003/D (49kB)2Mar, 2016
Termination of ECL Logic DevicesAND8020/D (176.0kB)6
The ECL Translator GuideAN1672/D (142.0kB)12
Thermal Analysis and Reliability of WIRE BONDED ECLAND8072/D (119.0kB)5
Using Wire-OR Ties in ECLInPS™ DesignsAN1650/D (1130.0kB)3
数据表 (1)
Document TitleDocument ID/SizeRevisionRevision Date
5 V ECL Divide by 4 DividerMC10EL33/D (165kB)11Jul, 2016
仿真模型 (2)
Document TitleDocument ID/SizeRevisionRevision Date
IBIS Model for MC100EL33D VEE -5.2 VMC100EL33D.IBS (12.0kB)2
IBIS Model for MC100EL33DPECL - Positive ECLMC100EL33DPECL.IBS (8.0kB)
封装图纸 (2)
Document TitleDocument ID/SizeRevision
SOIC-8 Narrow Body751-07 (62.6kB)AK
TSSOP 8 3.0x3.0x0.95 mm948R-02 (77.3kB)A
产品订购型号
产品状况Compliance封装MSL*容器预算价格 (1千个数量的单价)
MC100EL33DGActivePb-free Halide freeSOIC-8751-071Tube98联系BDTIC
MC100EL33DR2GActivePb-free Halide freeSOIC-8751-071Tape and Reel2500联系BDTIC
MC100EL33DTGLast ShipmentsPb-free Halide freeTSSOP-8948R-023Tube100
订购产品技术参数
ProductTypeInput LevelOutput LevelVCC Typ (V)fMax Typ (MHz)tpd Typ (ns)tR & tF Max (ps)
MC100EL33DGDividerECLECL542000.7350
MC100EL33DR2GDividerECLECL542000.7350
5 V ECL Divide by 4 Divider (165kB) MC10EL33
AC Characteristics of ECL Devices NB100LVEP91
Clock Generation and Clock and Data Marking and Ordering Information Guide NB100LVEP91
Clock Management Design Using Low Skew and Low Jitter Devices MC10H604
Designing with PECL (ECL at +5.0 V) NB100LVEP91
ECL Clock Distribution Techniques NB100LVEP91
ECLinPS and ECLinPS Lite SPICE I/O Modeling Kit MC100EP91
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information Guide NB100LVEP91
Interfacing Between LVDS and ECL NB100ELT23L
Interfacing with ECLinPS NB100LVEP91
Metastability and the ECLinPS Family MC10EPT20
Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks NUP4201
Phase Lock Loop General Operations MC10H604
Storage and Handling of Drypack Surface Mount Device NB3U23C
Termination of ECL Logic Devices NB100LVEP91
The ECL Translator Guide NB100LVEP91
Thermal Analysis and Reliability of WIRE BONDED ECL NB100LVEP91
Using Wire-OR Ties in ECLInPS™ Designs MC10H351
IBIS Model for MC100EL33D VEE -5.2 V MC100EL33
IBIS Model for MC100EL33DPECL - Positive ECL MC100EL33
SOIC-8 Narrow Body CM1216
TSSOP 8 3.0x3.0x0.95 mm NB100ELT23L