MC100EL39: 5.0 V ECL ÷2, ÷4, ÷8 Clock Generation Chip

The MC100EL39 is a low skew divide by 2/4, divide by 4/6 clock generation chip designed explicitly for low skew clock generation applications. The internal dividers are synchronous to each other, therefore, the common output edges are all precisely aligned.The VBB pin, an internally generated voltage supply, is available to this device only. For single-ended input conditions, the unused differentia input is connected to VBB as a switching reference voltage. VBB may also rebias AC coupled inputs. When used, decouple VBB and VCC via a 0.01 F capacitor and limit current sourcing or sinking to 0.5 mA. When not used, VBB should be left open.The common enable (ENbar) is synchronous so that the internal dividers will only be enabled/disabled when the internal clock is already in the LOW state. This avoids any chance of generating a runt clock pulse on the internal clock when the device is enabled/disabled as can happen with an asynchronous control. An internal runt pulse could lead to losing synchronization between the internal divider stages. The internal enable flip-flop is clocked on the falling edge of the input clock, therefore, all associated specification limits are referenced to the negative edge of the clock input.Upon startup, the internal flip-flops will attain a random state; therefore, for systems which utilize multiple EL39s, the master reset (MR) inputmust be asserted to ensure synchronization. For systems which only use one EL39, the MR pin need not be exercised as the internal divider design ensures synchronization between the divide by 2/4 and the divide by 4/6 outputs of a singledevice.

特性
  • 50 ps Output-to-Output Skew
  • Synchronous Enable/Disable
  • Master Reset for Synchronization
  • ESD Protection: > 2 KV HBM, > 100 V MM
  • The 100 Series Contains Temperature Compensation
  • PECL Mode Operating Range: VCC = 4.2 V to 5.7 V with VEE = 0 V
  • NECL Mode Operating Range: VCC = 0 V with VEE = -4.2 V to -5.7 V
  • Internal Input Pulldown Resistors on ENbar, MR, CLK(s), and DIVSEL(s)
  • Q Output will Default LOW with Inputs Open or at VEE
  • Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
  • Flammability Rating: UL-94 code V-0 @ 1/8", Oxygen Index 28 to 34
  • Transistor Count = 419 devices
  • Pb-Free Packages are Available
封装
应用注释 (17)
Document TitleDocument ID/SizeRevisionRevision Date
AC Characteristics of ECL DevicesAND8090/D (896.0kB)1
Clock Generation and Clock and Data Marking and Ordering Information GuideAND8002/D (71kB)12
Clock Management Design Using Low Skew and Low Jitter DevicesTND301/D (205.0kB)0
Designing with PECL (ECL at +5.0 V)AN1406/D (105.0kB)2
ECL Clock Distribution TechniquesAN1405/D (54.0kB)1
ECLinPS and ECLinPS Lite SPICE I/O Modeling KitAN1503/D (120.0kB)6
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information GuideAND8002 (71kB)12
Interfacing Between LVDS and ECLAN1568/D (121.0kB)11
Interfacing with ECLinPSAND8066/D (72kB)3
Metastability and the ECLinPS FamilyAN1504/D (103.0kB)3
Odd Number Divide By Counters with 50% Outputs and Synchronous ClocksAND8001/D (90.0kB)0
Phase Lock Loop General OperationsAND8040/D (64.0kB)3
Storage and Handling of Drypack Surface Mount DeviceAND8003/D (49kB)2Mar, 2016
Termination of ECL Logic DevicesAND8020/D (176.0kB)6
The ECL Translator GuideAN1672/D (142.0kB)12
Thermal Analysis and Reliability of WIRE BONDED ECLAND8072/D (119.0kB)5
Using Wire-OR Ties in ECLInPS™ DesignsAN1650/D (1130.0kB)3
数据表 (1)
Document TitleDocument ID/SizeRevisionRevision Date
5 V ECL Divide by 2/4, Divide by 4/6 Clock Generation ChipMC100EL39/D (153kB)8Jul, 2016
仿真模型 (1)
Document TitleDocument ID/SizeRevisionRevision Date
IBIS Model for MC100EL39DW -5.2VMC100EL39DW.IBS (13.0kB)1
封装图纸 (1)
Document TitleDocument ID/SizeRevision
SOIC-20 WB751D-05 (36.3kB)H
产品订购型号
产品状况Compliance封装MSL*容器预算价格 (1千个数量的单价)
MC100EL39DWR2GActivePb-free Halide freeSOIC-20W751D-053Tape and Reel1000联系BDTIC
订购产品技术参数
ProductTypeInput LevelOutput LevelVCC Typ (V)fMax Typ (MHz)tpd Typ (ns)tR & tF Max (ps)
MC100EL39DWR2GDividerECLECL512001.05550
5 V ECL Divide by 2/4, Divide by 4/6 Clock Generation Chip (153kB) MC100EL39
AC Characteristics of ECL Devices NB100LVEP91
Clock Generation and Clock and Data Marking and Ordering Information Guide NB100LVEP91
Clock Management Design Using Low Skew and Low Jitter Devices MC10H604
Designing with PECL (ECL at +5.0 V) NB100LVEP91
ECL Clock Distribution Techniques NB100LVEP91
ECLinPS and ECLinPS Lite SPICE I/O Modeling Kit MC100EP91
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information Guide NB100LVEP91
Interfacing Between LVDS and ECL NB100ELT23L
Interfacing with ECLinPS NB100LVEP91
Metastability and the ECLinPS Family MC10EPT20
Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks NUP4201
Phase Lock Loop General Operations MC10H604
Storage and Handling of Drypack Surface Mount Device NB3U23C
Termination of ECL Logic Devices NB100LVEP91
The ECL Translator Guide NB100LVEP91
Thermal Analysis and Reliability of WIRE BONDED ECL NB100LVEP91
Using Wire-OR Ties in ECLInPS™ Designs MC10H351
IBIS Model for MC100EL39DW -5.2V MC100EL39
SOIC-20 WB NLSX3018