MC100EL51: ECL Differential Clock/Data D Flip-Flop

The MC10EL/100EL51 is a differential clock D flip-flop with reset. The device is functionally similar to the E151 device with higher performance capabilities. With propagation delays and output transition times significantly faster than the E151 the EL51 is ideally suited for those applications which require the ultimate in AC performance. The reset input is an asynchronous, level triggered signal. Data enters the master portion of the flip-flop when the clock is LOW and is transferred to the slave, and thus the outputs, upon a positive transition of the clock. The differential clock inputs of the EL51 allow the device to be used as a negative edge triggered flip-flop. The differential input employs clamp circuitry to maintain stability under open input (pulled down to VEE) conditions.The 100 Series contains temperature compensation.

特性
  • 475ps Propagation Delay
  • 2.8GHz Toggle Frequency
  • ESD Protection: > 1 KV HBM, > 100 V MM
  • PECL Mode Operating Range: VCC= 4.2 V to 5.7 V with VEE= 0 V
  • NECL Mode Operating Range: VCC= 0 V with VEE= -4.2 V to -5.7 V
  • Internal Input Pulldown Resistors on D, R, and CLK
  • Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
  • Moisture Sensitivity Level 1For Additional Information, see Application Note AND8003/D
  • Flammability Rating: UL-94 code V-0 @ 1/8", Oxygen Index 28 to 34
  • Transistor Count = 73 devices
  • Pb-Free Packages are Available
应用注释 (17)
Document TitleDocument ID/SizeRevisionRevision Date
AC Characteristics of ECL DevicesAND8090/D (896.0kB)1
Clock Generation and Clock and Data Marking and Ordering Information GuideAND8002/D (71kB)12
Clock Management Design Using Low Skew and Low Jitter DevicesTND301/D (205.0kB)0
Designing with PECL (ECL at +5.0 V)AN1406/D (105.0kB)2
ECL Clock Distribution TechniquesAN1405/D (54.0kB)1
ECLinPS and ECLinPS Lite SPICE I/O Modeling KitAN1503/D (120.0kB)6
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information GuideAND8002 (71kB)12
Interfacing Between LVDS and ECLAN1568/D (121.0kB)11
Interfacing with ECLinPSAND8066/D (72kB)3
Metastability and the ECLinPS FamilyAN1504/D (103.0kB)3
Odd Number Divide By Counters with 50% Outputs and Synchronous ClocksAND8001/D (90.0kB)0
Phase Lock Loop General OperationsAND8040/D (64.0kB)3
Storage and Handling of Drypack Surface Mount DeviceAND8003/D (49kB)2Mar, 2016
Termination of ECL Logic DevicesAND8020/D (176.0kB)6
The ECL Translator GuideAN1672/D (142.0kB)12
Thermal Analysis and Reliability of WIRE BONDED ECLAND8072/D (119.0kB)5
Using Wire-OR Ties in ECLInPS™ DesignsAN1650/D (1130.0kB)3
封装图纸 (1)
Document TitleDocument ID/SizeRevision
SOIC-8 Narrow Body751-07 (62.6kB)AK
数据表 (1)
Document TitleDocument ID/SizeRevisionRevision Date
5 V ECL Differential Clock D Flip-FlopMC10EL51/D (162kB)8Jun, 2016
产品订购型号
产品状况Compliance封装MSL*容器预算价格 (1千个数量的单价)
MC100EL51DGActivePb-free Halide freeSOIC-8751-071Tube98联系BDTIC
订购产品技术参数
ProductTypeBitsInput LevelOutput LevelVCC Typ (V)tJitter Typ (ps)tpd Typ (ns)tsu Min (ns)th Min (ns)trec Typ (ns)tR & tF Max (ps)fToggle Typ (MHz)
MC100EL51DGD-Type1ECLECL510.4750.150.250.43502800
5 V ECL Differential Clock D Flip-Flop (162kB) MC10EL51
AC Characteristics of ECL Devices NB100LVEP91
Clock Generation and Clock and Data Marking and Ordering Information Guide NB100LVEP91
Clock Management Design Using Low Skew and Low Jitter Devices MC10H604
Designing with PECL (ECL at +5.0 V) NB100LVEP91
ECL Clock Distribution Techniques NB100LVEP91
ECLinPS and ECLinPS Lite SPICE I/O Modeling Kit MC100EP91
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information Guide NB100LVEP91
Interfacing Between LVDS and ECL NB100ELT23L
Interfacing with ECLinPS NB100LVEP91
Metastability and the ECLinPS Family MC10EPT20
Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks NUP4201
Phase Lock Loop General Operations MC10H604
Storage and Handling of Drypack Surface Mount Device NB3U23C
Termination of ECL Logic Devices NB100LVEP91
The ECL Translator Guide NB100LVEP91
Thermal Analysis and Reliability of WIRE BONDED ECL NB100LVEP91
Using Wire-OR Ties in ECLInPS™ Designs MC10H351
SOIC-8 Narrow Body CM1216