MC100LVE210: Clock / Data Fanout Buffer, 1:4 / 1:5 Differential, Dual ECL, 3.3 V

The MC100LVE210 is a low voltage, low skew dual differential ECL fanout buffer designed with clock distribution in mind. The device features two fanout buffers, a 1:4 and a 1:5 buffer, on a single chip. The device features fully differential clock paths to minimize both device and system skew. The dual buffer allows for the fanout of two signals through a single chip, thus reducing the skew between the two fundamental signals from a part-to-part skew down to an output-to-output skew. This capability reduces the skew by a factor of 4 as compared to using two LVE111's to accomplish the same task. To ensure that the tight skew specification is met it is necessary that both sides of the differential output are identically terminated, even if only one side is being used. In most applications all nine differential pairs will be used and therefore terminated. In the case where fewer than nine pairs are used it is necessary to terminate at least the output pairs adjacent to the output pair being used in order to maintain minimum skew. Failure to follow this guideline will result in small degradations of propagation delay (on the order of 10-20 ps) of the outputs being used, while not catastrophic to most designs this will result in an increase in skew. Note that the package corners isolate outputs from one another such that the guideline expressed above holds only for outputs on the same side of the package. The MC100LVE210, as with most ECL devices, can be operated from a positive VCC supply in PECL mode. This allows the LVE210 to be used for high performance clock distribution in +3.3 V systems. Designers can take advantage of the LVE210's performance to distribute low skew clocks across the backplane or the board. In a PECL environment series or Thevenin line terminations are typically used as they require no additional power supplies, if parallel termination is desired a terminating voltage of VCC -2.0 V will need to be provided. For more inf

特性
  • 200ps Part-to-Part Skew
  • 50ps Typical Output-to-Output Skew
  • The 100 Series Contains Temperature Compensation
  • ESD Protection: >2 KV HBM, >200 V MM
  • PECL Mode Operating Range: VCC = 3.0 V to 3.8 V with VEE = 0 V
  • NECL Mode Operating Range: VCC = 0 V with VEE = -3.0 V to -3.8 V
  • Internal Input Pulldown Resistors
  • Q Output will Default LOW with Inputs Open or at VEE
  • Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
  • Moisture Sensitivity Level 1For Additional Information, see Application Note AND8003/D
  • Flammability Rating: UL-94 code V-0 @ 1/8", Oxygen Index 28 to 34
  • Transistor Count = 179 devices
  • Pb-Free Packages are Available
应用注释 (15)
Document TitleDocument ID/SizeRevisionRevision Date
AC Characteristics of ECL DevicesAND8090/D (896.0kB)1
Clock Generation and Clock and Data Marking and Ordering Information GuideAND8002/D (66kB)11
Clock Management Design Using Low Skew and Low Jitter DevicesTND301/D (205.0kB)0
Designing with PECL (ECL at +5.0 V)AN1406/D (105.0kB)2
ECL Clock Distribution TechniquesAN1405/D (54.0kB)1
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information GuideAND8002 (66kB)11
Interfacing Between LVDS and ECLAN1568/D (121.0kB)11
Interfacing with ECLinPS™AND8066/D (58.0kB)2
Odd Number Divide By Counters with 50% Outputs and Synchronous ClocksAND8001/D (90.0kB)0
Phase Lock Loop General OperationsAND8040/D (64.0kB)3
Storage and Handling of Drypack Surface Mount DeviceAND8003/D (106.0kB)1
Termination of ECL Logic DevicesAND8020/D (176.0kB)6
The ECL Translator GuideAN1672/D (142.0kB)12
Thermal Analysis and Reliability of WIRE BONDED ECLAND8072/D (119.0kB)5
Using Wire-OR Ties in ECLInPS™ DesignsAN1650/D (1130.0kB)3
数据表 (1)
Document TitleDocument ID/SizeRevisionRevision Date
3.3V ECL Dual 1:4, 1:5 Differential Fanout BufferMC100LVE210/D (127.0kB)8
仿真模型 (3)
Document TitleDocument ID/SizeRevisionRevision Date
IBIS Model for MC100LVE210FN VCC 3.3 VMC100LVE210FN_33.IBS (9.0kB)3
IBIS Model for MC100LVE210FN VEE -3.3 VMC100LVE210FN_-33.IBS (9.0kB)3
Low Voltage ECLinPS SPICE Modeling KitAN1560/D (88.0kB)5
封装图纸 (1)
Document TitleDocument ID/SizeRevision
28 LEAD PLCC776-02 (67.7kB)F
产品订购型号
产品状况Compliance具体说明封装MSL*容器预算价格 (1千个数量的单价)
MC100LVE210FNGActivePb-free Halide freeClock / Data Fanout Buffer, 1:4 / 1:5 Differential, Dual ECL, 3.3 VPLCC-28776-023Tube37联系BDTIC
MC100LVE210FNR2GActivePb-free Halide freeClock / Data Fanout Buffer, 1:4 / 1:5 Differential, Dual ECL, 3.3 VPLCC-28776-023Tape and Reel500联系BDTIC
订购产品技术参数
ProductTypeChannelsInput / Output RatioInput LevelOutput LevelVCC Typ (V)tJitterRMS Typ (ps)tskew(o-o) Max (ps)tpd Typ (ns)tR & tF Max (ps)fmaxClock Typ (MHz)fmaxData Typ (Mbps)
MC100LVE210FNGBuffer11:4   1:5ECLECL3.30.2750.7600700
MC100LVE210FNR2GBuffer11:4   1:5ECLECL3.30.2750.7600700
3.3V ECL Dual 1:4, 1:5 Differential Fanout Buffer MC100LVE210
AC Characteristics of ECL Devices NB100LVEP91
Clock Generation and Clock and Data Marking and Ordering Information Guide NB100LVEP91
Clock Management Design Using Low Skew and Low Jitter Devices MC10H604
Designing with PECL (ECL at +5.0 V) NB100LVEP91
ECL Clock Distribution Techniques NB100LVEP91
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information Guide NB100LVEP91
Interfacing Between LVDS and ECL NB100ELT23L
Interfacing with ECLinPS NB100LVEP91
Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks NUP4201
Phase Lock Loop General Operations MC10H604
Storage and Handling of Drypack Surface Mount Device NB3U23C
Termination of ECL Logic Devices NB100LVEP91
The ECL Translator Guide NB100LVEP91
Thermal Analysis and Reliability of WIRE BONDED ECL NB100LVEP91
Using Wire-OR Ties in ECLInPS™ Designs MC10H351
IBIS Model for MC100LVE210FN VCC 3.3 V MC100LVE210
IBIS Model for MC100LVE210FN VEE -3.3 V MC100LVE210
Low Voltage ECLinPS SPICE Modeling Kit MC100LVELT23
28 LEAD PLCC MC10H604