MC100LVEL14: 3.3 V ECL 1:5 Clock Distribution Chip

The MC100LVEL14 is a low skew 1:5 clock distribution chip designed explicitly for low skew clock distribution applications. The device can be driven by either a differential or single-ended ECL or, if positive power supplies are used, PECL input signal. The LVEL14 is functionally and pin compatible with the EL14 but is designed to operate in ECL or PECL mode for a voltage supply range of -3.0 V to -3.8 V ( or 3.0 V to 3.8 V). The LVEL14 features a multiplexed clock input to allow for the distribution of a lower speed scan or test clock along with the high speed system clock. When LOW (or left open and pulled LOW by the input pulldown resistor) the SEL pin will select the differential clock input. The common enable (EN) is synchronous so that the outputs will only be enabled/disabled when they are already in the LOW state. This avoids any chance of generating a runt clock pulse when the device is enabled/disabled as can happen with an asynchronous control. The internal flip flop is clocked on the falling edge of the input clock, therefore all associated specification limits are referenced to the negative edge of the clock input. The VBB pin, an internally generated voltage supply, is available to this device only. For single-ended input conditions, the unused differential input is connected to VBB as a switching reference voltage. VBB may also rebias AC coupled inputs. When used, decouple VBB and VCC via a 0.01 5F capacitor and limit current sourcing or sinking to 0.5 mA. When not used, VBB should be left open.

特性
  • 50 ps Output-to-Output Skew
  • Synchronous Enable/Disable
  • Multiplexed Clock Input
  • ESD Protection: >2 KV HBM
  • The 100 Series Contains Temperature Compensation
  • PECL Mode Operating Range: VCC = 3.0 V to 3.8 V with VEE = 0 V
  • NECL Mode Operating Range: VCC = 0 V with VEE = -3.0 V to -3.8 V
  • Internal Input Pulldown Resistors on CLK
  • Q Output will Default LOW with Inputs Open or at VEE
  • Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
  • Flammability Rating: UL-94 code V-0 @ 1/8", Oxygen Index 28 to 34
  • Transistor Count = 303 devices
封装
应用注释 (15)
Document TitleDocument ID/SizeRevisionRevision Date
AC Characteristics of ECL DevicesAND8090/D (896.0kB)1
Clock Generation and Clock and Data Marking and Ordering Information GuideAND8002/D (71kB)12
Clock Management Design Using Low Skew and Low Jitter DevicesTND301/D (205.0kB)0
Designing with PECL (ECL at +5.0 V)AN1406/D (105.0kB)2
ECL Clock Distribution TechniquesAN1405/D (54.0kB)1
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information GuideAND8002 (71kB)12
Interfacing Between LVDS and ECLAN1568/D (121.0kB)11
Interfacing with ECLinPSAND8066/D (72kB)3
Odd Number Divide By Counters with 50% Outputs and Synchronous ClocksAND8001/D (90.0kB)0
Phase Lock Loop General OperationsAND8040/D (64.0kB)3
Storage and Handling of Drypack Surface Mount DeviceAND8003/D (49kB)2Mar, 2016
Termination of ECL Logic DevicesAND8020/D (176.0kB)6
The ECL Translator GuideAN1672/D (142.0kB)12
Thermal Analysis and Reliability of WIRE BONDED ECLAND8072/D (119.0kB)5
Using Wire-OR Ties in ECLInPS™ DesignsAN1650/D (1130.0kB)3
数据表 (1)
Document TitleDocument ID/SizeRevisionRevision Date
3.3 V ECL 1:5 Clock Distribution ChipMC100LVEL14/D (152kB)10Jul, 2016
仿真模型 (2)
Document TitleDocument ID/SizeRevisionRevision Date
IBIS Model for MC100LVEL14DW 3.3VMC100LVEL14DW_33.IBS (7.0kB)3
Low Voltage ECLinPS SPICE Modeling KitAN1560/D (88.0kB)5
封装图纸 (1)
Document TitleDocument ID/SizeRevision
SOIC-20 WB751D-05 (36.3kB)H
产品订购型号
产品状况Compliance封装MSL*容器预算价格 (1千个数量的单价)
MC100LVEL14DWGActivePb-free Halide freeSOIC-20W751D-053Tube38联系BDTIC
MC100LVEL14DWR2GActivePb-free Halide freeSOIC-20W751D-053Tape and Reel1000联系BDTIC
订购产品技术参数
ProductTypeChannelsInput / Output RatioInput LevelOutput LevelVCC Typ (V)tJitterRMS Typ (ps)tskew(o-o) Max (ps)tpd Typ (ns)tR & tF Max (ps)fmaxClock Typ (MHz)fmaxData Typ (Mbps)
MC100LVEL14DWGBuffer12:1:5ECL LVDSECL3.30.2500.685001000
MC100LVEL14DWR2GBuffer12:1:5LVDS ECLECL3.30.2500.685001000
3.3 V ECL 1:5 Clock Distribution Chip (152kB) MC100LVEL14
AC Characteristics of ECL Devices NB100LVEP91
Clock Generation and Clock and Data Marking and Ordering Information Guide NB100LVEP91
Clock Management Design Using Low Skew and Low Jitter Devices MC10H604
Designing with PECL (ECL at +5.0 V) NB100LVEP91
ECL Clock Distribution Techniques NB100LVEP91
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information Guide NB100LVEP91
Interfacing Between LVDS and ECL NB100ELT23L
Interfacing with ECLinPS NB100LVEP91
Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks NUP4201
Phase Lock Loop General Operations MC10H604
Storage and Handling of Drypack Surface Mount Device NB3U23C
Termination of ECL Logic Devices NB100LVEP91
The ECL Translator Guide NB100LVEP91
Thermal Analysis and Reliability of WIRE BONDED ECL NB100LVEP91
Using Wire-OR Ties in ECLInPS™ Designs MC10H351
IBIS Model for MC100LVEL14DW 3.3V MC100LVEL14
Low Voltage ECLinPS SPICE Modeling Kit MC100LVELT23
SOIC-20 WB NLSX3018