MC10E122: ECL 9-Bit Buffer

The MC10E/100E122 is a 9-bit buffer. The device contains nine non-inverting buffer gates.The 100 Series contains temperature compensation.

特性
  • 500ps Max. Propagation Delay
  • PECL Mode Operating Range: VCC = 4.2 V to 5.7 V with VEE = 0 V
  • NECL Mode Operating Range: VCC = 0 V with VEE = -4.2 V to -5.7 V
  • Internal Input Pulldown Resistors
  • ESD Protection: > 2 KV HBM, > 200 V MM
  • Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
  • Moisture Sensitivity Level 1For Additional Information, see Application Note AND8003/D
  • Flammability Rating: UL-94 code V-0 @ 1/8", Oxygen Index 28 to 34
  • Transistor Count = 111 devices
  • Pb-Free Packages are Available
应用注释 (17)
Document TitleDocument ID/SizeRevisionRevision Date
AC Characteristics of ECL DevicesAND8090/D (896.0kB)1
Clock Generation and Clock and Data Marking and Ordering Information GuideAND8002/D (66kB)11
Clock Management Design Using Low Skew and Low Jitter DevicesTND301/D (205.0kB)0
Designing with PECL (ECL at +5.0 V)AN1406/D (105.0kB)2
ECL Clock Distribution TechniquesAN1405/D (54.0kB)1
ECLinPS and ECLinPS Lite SPICE I/O Modeling KitAN1503/D (120.0kB)6
ECLinPS™ Circuit Performance at Non-Standard VIH LevelsAN1404/D (51.0kB)1
Interfacing Between LVDS and ECLAN1568/D (121.0kB)11
Interfacing with ECLinPS™AND8066/D (58.0kB)2
Metastability and the ECLinPS FamilyAN1504/D (103.0kB)3
Odd Number Divide By Counters with 50% Outputs and Synchronous ClocksAND8001/D (90.0kB)0
Phase Lock Loop General OperationsAND8040/D (64.0kB)3
Storage and Handling of Drypack Surface Mount DeviceAND8003/D (106.0kB)1
Termination of ECL Logic DevicesAND8020/D (176.0kB)6
The ECL Translator GuideAN1672/D (142.0kB)12
Thermal Analysis and Reliability of WIRE BONDED ECLAND8072/D (119.0kB)5
Using Wire-OR Ties in ECLInPS™ DesignsAN1650/D (1130.0kB)3
数据表 (1)
Document TitleDocument ID/SizeRevisionRevision Date
5V ECL 9-Bit BufferMC10E122/D (121.0kB)7
仿真模型 (1)
Document TitleDocument ID/SizeRevisionRevision Date
IBIS Model for MC10E122FNMC10E122FN.IBS (6.0kB)
封装图纸 (1)
Document TitleDocument ID/SizeRevision
28 LEAD PLCC776-02 (67.7kB)F
产品订购型号
产品状况Compliance具体说明封装MSL*容器预算价格 (1千个数量的单价）
MC10E122FNGActivePb-free Halide freeECL 9-Bit BufferPLCC-28776-023Tube37联系BDTIC
MC10E122FNR2GActivePb-free Halide freeECL 9-Bit BufferPLCC-28776-023Tape and Reel500联系BDTIC
订购产品技术参数
ProductTypeChannelsInput / Output RatioInput LevelOutput LevelVCC Typ (V)tJitterRMS Typ (ps)tskew(o-o) Max (ps)tpd Typ (ns)tR & tF Max (ps)fmaxClock Typ (MHz)fmaxData Typ (Mbps)
MC10E122FNGSignal Driver91:1ECLECL5<1750.35800800
MC10E122FNR2GSignal Driver91:1ECLECL5<1750.35800800
5V ECL 9-Bit Buffer MC10E122
AC Characteristics of ECL Devices NB100LVEP91
Clock Generation and Clock and Data Marking and Ordering Information Guide NB100LVEP91
Clock Management Design Using Low Skew and Low Jitter Devices MC10H604
Designing with PECL (ECL at +5.0 V) NB100LVEP91
ECL Clock Distribution Techniques NB100LVEP91
ECLinPS and ECLinPS Lite SPICE I/O Modeling Kit MC100EP91
ECLinPS™ Circuit Performance at Non-Standard VIH Levels MC10E195
Interfacing Between LVDS and ECL NB100ELT23L
Interfacing with ECLinPS NB100LVEP91
Metastability and the ECLinPS Family MC10EPT20
Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks NUP4201
Phase Lock Loop General Operations MC10H604
Storage and Handling of Drypack Surface Mount Device NB3U23C
Termination of ECL Logic Devices NB100LVEP91
The ECL Translator Guide NB100LVEP91
Thermal Analysis and Reliability of WIRE BONDED ECL NB100LVEP91
Using Wire-OR Ties in ECLInPS™ Designs MC10H351
IBIS Model for MC10E122FN MC10E122
28 LEAD PLCC MC10H604
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