MC10EL34: 5.0 V ECL ÷·2, ÷·4, ÷·8 Clock Generation Chip

The MC10/100EL34 is a low skew divide by 2, divide by 4, divide by 8 clock generation chip designed explicitly for low skew clock generation applications. The internal dividers are synchronous to each other, therefore, the common output edges are all precisely aligned. The device can be driven by either a differential or single-ended ECL or, if positive power supplies are used, PECL input signal. In addition, by using the VBB output, a sinusoidal source can be AC coupled into the device (see Interfacing section of the ECLinPS Data Book DL140/D). If a single-ended input is to be used, the VBB output should be connected to the CLK input and bypassed to ground via a 0.01 F capacitor. The VBB output is designed to act as the switching reference for the input of the EL34 under single-ended input conditions, as a result, this pin can only source/sink up to 0.5mA of current. The common enable (EN) is synchronous so that the internal dividers will only be enabled/disabled when the internal clock is already in the LOW state. This avoids any chance of generating a runt clock pulse on the internal clock when the device is enabled/disabled as can happen with an asynchronous control. An internal runt pulse could lead to losing synchronization between the internal divider stages. The internal enable flip-flop is clocked on the falling edge of the input clock, therefore, all associated specification limits are referenced to the negative edge of the clock input. Upon startup, the internal flip-flops will attain a random state; the master reset (MR) input allows for the synchronization of the internal dividers, as well as multiple EL34s in a system.The 100 Series contains temperature compensation.

特性
  • 50ps Output-to-Output Skew
  • Synchronous Enable/Disable
  • Master Reset for Synchronization
  • PECL Mode Operating Range: VCC = 4.2 V to 5.7 V with VEE = 0 V
  • NECL Mode Operating Range: VCC = 0 V with VEE = -4.2 V to -5.7 V
  • Internal Input Pulldown Resistors on CLK(s), ENbar, and MR
  • Pb-Free Packages are Available
应用注释 (17)
Document TitleDocument ID/SizeRevisionRevision Date
AC Characteristics of ECL DevicesAND8090/D (896.0kB)1
Clock Generation and Clock and Data Marking and Ordering Information GuideAND8002/D (71kB)12
Clock Management Design Using Low Skew and Low Jitter DevicesTND301/D (205.0kB)0
Designing with PECL (ECL at +5.0 V)AN1406/D (105.0kB)2
ECL Clock Distribution TechniquesAN1405/D (54.0kB)1
ECLinPS and ECLinPS Lite SPICE I/O Modeling KitAN1503/D (120.0kB)6
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information GuideAND8002 (71kB)12
Interfacing Between LVDS and ECLAN1568/D (121.0kB)11
Interfacing with ECLinPSAND8066/D (72kB)3
Metastability and the ECLinPS FamilyAN1504/D (103.0kB)3
Odd Number Divide By Counters with 50% Outputs and Synchronous ClocksAND8001/D (90.0kB)0
Phase Lock Loop General OperationsAND8040/D (64.0kB)3
Storage and Handling of Drypack Surface Mount DeviceAND8003/D (49kB)2Mar, 2016
Termination of ECL Logic DevicesAND8020/D (176.0kB)6
The ECL Translator GuideAN1672/D (142.0kB)12
Thermal Analysis and Reliability of WIRE BONDED ECLAND8072/D (119.0kB)5
Using Wire-OR Ties in ECLInPS™ DesignsAN1650/D (1130.0kB)3
数据表 (1)
Document TitleDocument ID/SizeRevisionRevision Date
5 V ECL Divide by 2, Divide by 4, Divide by 8 Clock Generation ChipMC10EL34/D (168kB)11Jul, 2016
仿真模型 (2)
Document TitleDocument ID/SizeRevisionRevision Date
IBIS Model for mc10el34d -5.0VMC10EL34D_-50.IBS (6.0kB)1
IBIS Model for mc10el34d 5.0VMC10EL34D_50.IBS (6.0kB)2
封装图纸 (1)
Document TitleDocument ID/SizeRevision
SOIC 16 LEAD751B-05 (38.2kB)K
产品订购型号
产品状况Compliance封装MSL*容器预算价格 (1千个数量的单价)
MC10EL34DGActivePb-free Halide freeSOIC-16751B-051Tube48联系BDTIC
订购产品技术参数
ProductTypeInput LevelOutput LevelVCC Typ (V)fMax Typ (MHz)tpd Typ (ns)tR & tF Max (ps)
MC10EL34DGDividerECLECL511001.08475
5 V ECL Divide by 2, Divide by 4, Divide by 8 Clock Generation Chip (168kB) MC10EL34
AC Characteristics of ECL Devices NB100LVEP91
Clock Generation and Clock and Data Marking and Ordering Information Guide NB100LVEP91
Clock Management Design Using Low Skew and Low Jitter Devices MC10H604
Designing with PECL (ECL at +5.0 V) NB100LVEP91
ECL Clock Distribution Techniques NB100LVEP91
ECLinPS and ECLinPS Lite SPICE I/O Modeling Kit MC100EP91
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information Guide NB100LVEP91
Interfacing Between LVDS and ECL NB100ELT23L
Interfacing with ECLinPS NB100LVEP91
Metastability and the ECLinPS Family MC10EPT20
Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks NUP4201
Phase Lock Loop General Operations MC10H604
Storage and Handling of Drypack Surface Mount Device NB3U23C
Termination of ECL Logic Devices NB100LVEP91
The ECL Translator Guide NB100LVEP91
Thermal Analysis and Reliability of WIRE BONDED ECL NB100LVEP91
Using Wire-OR Ties in ECLInPS™ Designs MC10H351
IBIS Model for mc10el34d -5.0V MC10EL34
IBIS Model for mc10el34d 5.0V MC10EL34
SOIC 16 LEAD MC14504B