MC10EP32: 3.3 V / 5.0 V ECL ÷·2 Divider

The MC10/100EP32 is an integrated divide by 2 divider with differential CLK inputs.The VBB pin, an internally generated voltage supply, is available to this device only. For single-ended input conditions, the unused differential input is connected to VBB as a switching reference voltage. VBB may also rebias AC coupled inputs. When used, decouple VBB and VCC via a 0.01μF capacitor and limit current sourcing or sinking to 0.5mA. When not used, VBB should be left open.The reset pin is asynchronous and is asserted on the rising edge. Upon power-up, the internal flip-flops will attain a random state; the reset allows for the synchronization of multiple EP32's in a system.The 100 Series contains temperature compensation.

特性
  • 350ps Typical Propagation Delay
  • Maximum Frequency > 4 GHz Typical
  • PECL Mode Operating Range: VCC= 3.0 V to 5.5 Vwith VEE= 0 V
  • NECL Mode Operating Range: VCC= 0 Vwith VEE= –3.0 V to –5.5 V
  • Open Input Default State
  • Safety Clamp on Inputs
  • Q Output will default LOW with inputs open or at VEE
  • Pb-Free Packages are Available
应用
  • Reduce System clock skew over the alternative CMOS and TTL technologies.
封装
应用注释 (16)
Document TitleDocument ID/SizeRevisionRevision Date
AC Characteristics of ECL DevicesAND8090/D (896.0kB)1
Clock Generation and Clock and Data Marking and Ordering Information GuideAND8002/D (71kB)12
Designing with PECL (ECL at +5.0 V)AN1406/D (105.0kB)2
ECL Clock Distribution TechniquesAN1405/D (54.0kB)1
ECLinPS Plus™ Spice Modeling KitAND8009/D (343.0kB)11
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information GuideAND8002 (71kB)12
Interfacing Between LVDS and ECLAN1568/D (121.0kB)11
Interfacing with ECLinPSAND8066/D (72kB)3
Metastability and the ECLinPS FamilyAN1504/D (103.0kB)3
Odd Number Divide By Counters with 50% Outputs and Synchronous ClocksAND8001/D (90.0kB)0
Phase Lock Loop General OperationsAND8040/D (64.0kB)3
Storage and Handling of Drypack Surface Mount DeviceAND8003/D (49kB)2Mar, 2016
Termination of ECL Logic DevicesAND8020/D (176.0kB)6
The ECL Translator GuideAN1672/D (142.0kB)12
Thermal Analysis and Reliability of WIRE BONDED ECLAND8072/D (119.0kB)5
Using Wire-OR Ties in ECLInPS™ DesignsAN1650/D (1130.0kB)3
数据表 (1)
Document TitleDocument ID/SizeRevisionRevision Date
3.3 V / 5 V ECL Divide by 2 DividerMC10EP32/D (191kB)12Jul, 2016
仿真模型 (1)
Document TitleDocument ID/SizeRevisionRevision Date
IBIS Model for MC10EP32D 3.3VMC10EP32D_33.IBS (5.0kB)1
封装图纸 (3)
Document TitleDocument ID/SizeRevision
DFN8 2.0x2.0x0.9mm, 0.5p506AA (31.8kB)F
SOIC-8 Narrow Body751-07 (62.6kB)AK
TSSOP 8 3.0x3.0x0.95 mm948R-02 (77.3kB)A
产品订购型号
产品状况Compliance封装MSL*容器预算价格 (1千个数量的单价)
MC10EP32DGActivePb-free Halide freeSOIC-8751-071Tube98联系BDTIC
MC10EP32DR2GActivePb-free Halide freeSOIC-8751-071Tape and Reel2500联系BDTIC
MC10EP32DTGActivePb-free Halide freeTSSOP-8948R-023Tube100联系BDTIC
MC10EP32DTR2GActivePb-free Halide freeTSSOP-8948R-023Tape and Reel2500联系BDTIC
MC10EP32MNR4GActivePb-free Halide freeDFN-8506AA1Tape and Reel1000联系BDTIC
订购产品技术参数
ProductTypeInput LevelOutput LevelVCC Typ (V)fMax Typ (MHz)tpd Typ (ns)tR & tF Max (ps)
MC10EP32DGDividerECL CMLECL5 3.340000.35150
MC10EP32DR2GDividerCML ECLECL5 3.340000.35150
MC10EP32DTGDividerCML ECLECL5 3.340000.35150
MC10EP32DTR2GDividerECL CMLECL5 3.340000.35150
MC10EP32MNR4GDividerCML ECLECL5 3.340000.35150
3.3 V / 5 V ECL Divide by 2 Divider (191kB) MC10EP32
AC Characteristics of ECL Devices NB100LVEP91
Clock Generation and Clock and Data Marking and Ordering Information Guide NB100LVEP91
Designing with PECL (ECL at +5.0 V) NB100LVEP91
ECL Clock Distribution Techniques NB100LVEP91
ECLinPS Plus™ Spice Modeling Kit MC10EPT20
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information Guide NB100LVEP91
Interfacing Between LVDS and ECL NB100ELT23L
Interfacing with ECLinPS NB100LVEP91
Metastability and the ECLinPS Family MC10EPT20
Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks NUP4201
Phase Lock Loop General Operations MC10H604
Storage and Handling of Drypack Surface Mount Device NB3U23C
Termination of ECL Logic Devices NB100LVEP91
The ECL Translator Guide NB100LVEP91
Thermal Analysis and Reliability of WIRE BONDED ECL NB100LVEP91
Using Wire-OR Ties in ECLInPS™ Designs MC10H351
IBIS Model for MC10EP32D 3.3V MC10EP32
SOIC-8 Narrow Body CM1216
TSSOP 8 3.0x3.0x0.95 mm NB100ELT23L
DFN8 2.0x2.0x0.9mm, 0.5p NUF4220