HA1631D03T
| 下载文件 |
|---|
| HA1631D03T.pdf |
Pin Assignment |
Dimensions |
| Star Product | - |
|---|---|
| Process | CMOS |
| Ch. | Dual |
| Single Supply (V) min. | 1.8 |
| Single Supply (V) max. | 5.5 |
| Input Offset Voltage Vio (±mV) max. | 5 |
| Supply Current Icc/Idd (mA) max. | 0.005 |
| Response Time TPHL (μs) typ. | 0.55 |
| Operating Temperature Topr (°C) min. | -40 |
| Operating Temperature Topr (°C) max. | 85 |
| Output Current Io Sink (mA) typ. | 14 |
| Package Type | TSSOP |
| Production Status | Non-promotion |
| Name | TSSOP |
|---|---|
| JEITA code | P-TSSOP8-4.4x3-0.65 |
| Previous code | TTP-8DAV |
| Renesas code | PTSP0008JC-B |
| Terminal count | 8 |
| Terminal pitch (mm) | 0.65 mm |
| Dimensions (mm) | 4.4x3 |
| Mass (g) [TYP,] | 0.034 |
| Drawing Link | ptsp0008jc_b |
| Mount pad | fig0004e |
| Terminal material - Base | Cu alloy |
| Terminal material - Surface | Ni/Pd/Au |
| ContainerTape No dry pack | tape-ND |
|---|---|
| Tape Complete dry pack | tape-D |
| Tape | tape2119；tape2025 |
订购型号
| 型号 | 状态 | 产品长期供应计划 | 预算价格（1000片） | 包装 | 明星产品 | RoHS |
|---|---|---|---|---|---|---|
| HA1631D03TEL-E | Non-promotion | Mar, 2030 | | MOQ:3000| WRAP_SPEC:Embossed Tape| OTHER_ENV: | false | 无铅 |
