TS5A3157 10Ω SPDT 模拟开关

TS5A3157
Configuration 1 X SPDT  
ron(max)(ohms) 10  
IL OFF(Max)(nA) N/A  
OFF Time(Max)(ns) 6.5  
ON Time(Max)(ns) 8.5  
Operating Temperature Range(°C) -40 to 85  
Pin/Package 6DSBGA, 6SC70, 6SOT-23  
Approx. Price (US$) 0.16 | 1ku  
VCC(Min)(V) 5.5  
Voltage Nodes(V) 1.8, 2.5, 3.0, 3.3, 5.0  
RON Flatness(Max)(Ohms) 5  
Technology Family TS  
ESD Rating(kV) 2kV HBM  
Bandwidth(MHz) 300  
Charge Injection(Max)(pC) 7  
RON Mis-match(Max)(Ohms) 0.2  
Voltage Node(V) 1.8, 2.5, 3.0, 3.3, 5.0  
Vcc max(V) 5.5  
Vcc min(V) 1.65  
Number of Channels 1  
Vcc range(V) 1.65 to 5.5  
ICC(uA) 0.05  
Rating Catalog
TS5A3157 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
TS5A3157DBVR ACTIVE -40 to 85 0.16 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R  
TS5A3157DBVRE4 ACTIVE -40 to 85 0.16 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R  
TS5A3157DBVRG4 ACTIVE -40 to 85 0.16 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R  
TS5A3157DCKR ACTIVE -40 to 85 0.16 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R  
TS5A3157DCKRE4 ACTIVE -40 to 85 0.16 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R  
TS5A3157DCKRG4 ACTIVE -40 to 85 0.16 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R  
TS5A3157YZPR ACTIVE -40 to 85 0.22 | 1ku DSBGA (YZP) | 6 3000 | LARGE T&R  
TS5A3157 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TS5A3157DBVR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TS5A3157DBVR TS5A3157DBVR
TS5A3157DBVRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TS5A3157DBVRE4 TS5A3157DBVRE4
TS5A3157DBVRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TS5A3157DBVRG4 TS5A3157DBVRG4
TS5A3157DCKR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TS5A3157DCKR TS5A3157DCKR
TS5A3157DCKRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TS5A3157DCKRE4 TS5A3157DCKRE4
TS5A3157DCKRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TS5A3157DCKRG4 TS5A3157DCKRG4
TS5A3157YZPR Green (RoHS & no Sb/Br)  SNAGCU  Level-1-260C-UNLIM TS5A3157YZPR TS5A3157YZPR
TS5A3157 应用技术支持与电子电路设计开发资源下载
  1. TS5A3157 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器信号开关产品选型与价格 . xls
  3. Logic Guide 2009 (PDF 4263 KB)
  4. 防止模拟开关的额外功耗 (PDF 392 KB) (PDF 1305 KB)
  5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  9. Designing With Logic (PDF 186 KB)
  10. Live Insertion (PDF 150 KB)
  11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  14. LOGIC Pocket Data Book (PDF 6001 KB)
  15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  16. Logic Cross-Reference (PDF 2938 KB)