ADG888BCBZ-REEL: 0.4 Ω CMOS, Dual DPDT Switch in WLCSP/LFCSP/TSSOP Packages
The ADG888 is a low voltage, dual DPDT (double-pole, double-throw) CMOS device optimized for high performance audio switching. With its low power and small physical size, it is ideal for portable devices.
This device offers ultralow on resistance of less than 0.8 Ω over the full temperature range, making it an ideal solution for applications requiring minimal distortion through the switch. The ADG888 also has the capability of carrying large amounts of current, typically 400 mA at 5 V operation.
When on, each switch conducts equally well in both directions and has an input signal range that extends to the supplies. The ADG888 exhibits break-before-make switching action.
The ADG888 is available in a 16-ball WLCSP, 16-lead LFCSP, and a 16-lead TSSOP. These packages make the ADG888 the ideal solution for space-constrained applications.
产品焦点 Product Highlights
- <0.6 Ω over full temperature range of −40°C to +125°C.
- High current handling capability (400 mA continuous current at 5 V).
- Low THD + N (0.008% typical).
- Tiny 16-ball WLCSP, 16-lead LFCSP, and 16-lead TSSOP.
产品应用领域 Applications
- Cellular phones
- PDAs
- MP3 players
- Power routing
- Battery-powered systems
- PCMCIA cards
- Modems
- Audio and video signal routing
- Communication systems
- Data switching
ADG888BCBZ-REEL 特点
- 1.8 V to 5.5 V operation
- Ultralow on resistance
0.4 Ω typical
0.6 Ω maximum at 5 V supply - Excellent audio performance, ultralow distortion
0.07 Ω typical
0.14 Ω maximum - RON flatness
- High current carrying capability
400 mA continuous
600 mA peak current at 5 V - Automotive temperature range: −40°C to +125°C
- Rail-to-rail switching operation
- Typical power consumption (<0.1 μW)
ADG888BCBZ-REEL 功能框图
ADG888 芯片订购指南
| 产品型号 | 产品状态 | 封装 | 引脚 | 温度范围 |
|---|---|---|---|---|
| ADG888BCBZ-REEL | 量产 | 16 Ball WLCSP(2X2X.59) | 16 | 工业 |
| ADG888BCBZ-REEL7 | 量产 | 16 Ball WLCSP(2X2X.59) | 16 | 工业 |
| ADG888YCPZ-REEL | 量产 | 16 ld LFCSP (4x4x.85mm, 2.10mm exposed pad) | 16 | 工业 |
| ADG888YCPZ-REEL7 | 量产 | 16 ld LFCSP (4x4x.85mm, 2.10mm exposed pad) | 16 | 工业 |
| ADG888YRUZ | 量产 | 16 ld TSSOP | 16 | 工业 |
| ADG888YRUZ-REEL | 量产 | 16 ld TSSOP | 16 | 工业 |
| ADG888YRUZ-REEL7 | 量产 | 16 ld TSSOP | 16 | 工业 |
| EVAL-ADG888EBZ | 量产 | 评估板 | - | 待定 |
ADG888BCBZ-REEL 应用技术支持与电子电路设计开发资源下载
- ADG888 数据手册DataSheet下载 . pdf
- Analog Devices, Inc.ADI 美国模拟器件公司产品订购手册 .pdf
- ADC模数转换器选型指南 . pdf
