ADSP-21371 面向汽车音频的32位高性能浮点SHARC处理器

ADSP-21371:面向汽车音频的32位高性能浮点SHARC处理器

ADSP-21371 功能框图第三代SHARC®处理器，其中包括ADSP-21375和ADSP-21371，提供了更高的性能、以音频和应用为重点的外设和存储器配置，能够支持环绕声解码器算法。所有的器件与其它SHARC处理器如ADSP-21367和ADSP-21369在引脚和代码方面完全兼容。这些SHARC处理器基于一个单指令多数据（SIMD）内核，支持32位定点和32/40位浮点运算格式，使它们特别适合于高性能音频应用。在第三代SHARC处理器系列中，ADSP-21371能以极低的成本提供266 MHz/1596 MFLOP的高性能。这样的性能水平使ADSP - 21371特别适合于解决日益增长的专业和车载音响市场需求，同时保持了低成本。除了更高的内核性能，ADSP-21371包含了更多的增值外设如S/PDIF发射器/接收器。ADSP-21371还提供一个运行于133 MHz的32位接口，可直接与同步SDRAM接口。第三代SHARC处理器还集成了专用的外设，旨在简化硬件设计，最大限度地减少设计风险，并最终缩短上市时间。这些功能模块组合起来，加上广为人知的数字音频接口（DAI），通过软件可编程的信号路由单元（SRU）可以彼此连接或连接至外部引脚。SRU是一个创新的架构特性，可以在DAI模块之间实现完整而灵活的路由。通过SRU连接的外设包括但不限于：串行接口、SPI端口和S/PDIF Tx/Rx。

The third generation of SHARC® Processors, which includes the ADSP-21375 and ADSP-21371, offers increased performance, audio and application-focused peripherals, and memory configurations capable of supporting surround-sound decoder algorithms. All devices are pin-compatible and completely code-compatible with other SHARC Processors such as the ADSP-21367 and ADSP-21369. These members of the SHARC Processor family are based on a single-instruction, multiple-data (SIMD) core, which supports both 32-bit fixed-point and 32-/40-bit floating-point arithmetic formats making them particularly suitable for high-performance audio applications.

The ADSP-21371 offers a high performance at a very low cost 266 MHz/1596 MFLOPs -- within the third generation SHARC Processor family. This level of performance makes the ADSP-21371 particularly well suited to address the increasing requirements of the professional and automotive audio market segments while maintaining a low cost. In addition to its higher core performance, the ADSP-21371 includes additional value-added peripherals such as an S/PDIF transmitter/receiver. The ADSP-21371 also provides a direct interface to synchronous SDRAMs with a 32-bit interface that operates at 133 MHz.

Third generation SHARC Processors also integrate application-specific peripherals designed to simplify hardware design, minimize design risks, and ultimately reduce time to market. Grouped together, and broadly named the Digital Audio Interface (DAI), these functional blocks may be connected to each other or to external pins via the software-programmable Signal Routing Unit (SRU). The SRU is an innovative architectural feature that enables complete and flexible routing amongst DAI blocks. Peripherals connected through the SRU include but are not limited to serial ports, SPI ports, and S/PDIF Tx/Rx.

技术特性

266 MHz SIMD SHARC内核，峰值性能可达到1596 MFLOPS
1Mb SRAM、内嵌行业标准音频解码和后处理系数的4 Mb ROM
32位DMA以外设时钟速度传送，与全速处理器执行并行
32位宽外部端口提供与同步（SDRAM）和异步存储器的无胶合接口
数字音频接口(DAI)可实现对于外设的用户可定义访问，包括S/PDIF Tx/Rx
从主存储器直接执行
延迟线DMA引擎通过抽头/偏移的读取来维护外部存储器的循环缓冲区
8个支持I2S、左对齐采样对和TDM模式的串行端口
两个支持主和从模式的SPI端口
16个PWM通道
3个全特性定时器
208引脚LQFP EP封装：商业和工业温度范围

技术指标

Clock Speed (MHz): 266MHz
MMACs: 532
On-Chip SRAM (Mbits): 1Mbit
Serial Ports: 8
DAI: X
Package: LQFP

应用领域

汽车音频
专业音频
工业和仪器仪表
消费类AVR
数字音频放大器

订购型号

产品型号	产品状态	封装	引脚	温度范围	包装和数量	报价*(100-499)	报价*1000 pcs	RoHS
ADSP-21371BSWZ-2B	量产	208 ld LQFP (28x28x1.4mm w/7mm heatsink)	208	工业	Tray, 36	$ 19.37	$ 15.92	是
ADSP-21371KSWZ-2A	-		208	商业	Tray, 36	-	-	是
ADSP-21371KSWZ-2B	量产	208 ld LQFP (28x28x1.4mm w/7mm heatsink)	208	商业	Tray, 36	$ 16.14	$ 13.27	是

开发工具

产品型号	产品状态	封装	引脚	温度范围	包装和数量	报价*(100-499)	报价*1000 pcs	RoHS
ADZS-21371-EZLITE	量产	评估板	-		1	$ 495.00	$ 495.00	是