MADP-000235-10720T Non-Magnetic MELF PIN Diode

The MADP-000235-10720T is a surface mount PIN diode in a non-magnetic Metal Electrode Leadless Faced (MELF) package. The MADP-000235-10720T is manufactured using M/A-COM Technology Solutions time proven HIPAX technology. The result is a low inductance ceramic package with no ribbons or wires. The package utilizes a unique non-magnetic plating process that provides for a hermetically sealed component that has extremely low electromagnetic permeability. Incorporated in the package is a glass passivated CERMA chip that is full face bonded on the cathode and anode which maximizes the surface contact area to minimize the electrical and thermal resistances. The chip and package have been comprehensively characterized both electrically and mechanically to ensure repeatable and predictable performance.

技术特性 Features
  • Non-Magnetic Package for MRI Applications
  • Rectangular MELF Ceramic Package
  • Hermetically Sealed
  • RoHS Compliant
订购信息 Ordering Information
  • MADP-000235-10720T 1500
应用领域Applications

The MADP-000235-10720T is designed for circuit protection and the tuning of RF coil designs in MRI applications. When connected in an anti-parallel configuration these PIN diodes provide excellent protection from long RF pulses and spikes.

MADP-000235-10720T 产品实物图

MADP-000235-10720T 产品实物图


应用技术支持与电子电路设计开发资源下载 版本信息 大小
MADP-000235-10720T 数据资料DataSheet下载.pdf Rev.V2 2 页