MADS-001317-1320AG GaAs Solder Bump Flip Chip Schottky Diode

M/A-COM’s MADS-001317-1320AG is a Gallium Arsenide Flip-Chip Schottky diode with solder bumps. These devices are fabricated on OMCVD epitaxial wafers using a process designed for high device uniformity and extremely low parasitics. This device can be used up to 80 GHz. This diode is fully passivated with silicon nitride and has an additional layer of a polymer for scratch protection. The protective coatings prevent damage to the junction during handling and circuit attachment.

技术特性 Features

Low Resistance, 4 Ω
Low Capacitance, 45 fF
High Cutoff Frequency
Silicon Nitride Passivation
Polyimide Scratch Protection
Solderable Bump Die Attach

订购信息 Ordering Information

MADS-001317-1320AG Gel Pack

应用领域 Applications

The high cutoff frequency of this device allows use through millimeter wave frequencies. Typical Applications include single and double balanced mixers in PCN transceivers, radios, police radar detectors and automotive radar detectors.

MADS-001317-1320AG 产品实物图

应用技术支持与电子电路设计开发资源下载	版本信息	大小
MADS-001317-1320AG 数据资料DataSheet下载：PDF	Rev.V2	2 页