MASW-008902-000DIE Bumped GaAs SP3T Switch for WLAN 2.4 - 2.5 GHz

The MASW-008902-000DIE is a bumped single band GaAs pHEMT MMIC SP3T switch. Typical applications are for single band 2.4 GHz WLAN (802.11 b/g) and Bluetooth applications. The MASW-008902-000DIE delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 GHz. The MASW-008902-000DIE is fabricated using a 0.5 micron gate length GaAs pHEMT process. The process features full passivation for performance and reliability. This die features SnAg (2.5%) solder bumps for WLCSP applications.

技术特性 Features
  • 802.11b/g and Bluetooth Applications
  • Insertion Loss: 0.60 dB typical
  • Isolation:
    31 dB typical (RX Path)
    22 dB typical (TX / BT paths)
  • Flip-chip configuration
  • RoHS* Compliant
订购信息 Ordering Information
  • MASW-008902-000DIE Separated Die on Grip Ring
  • MASW-008902-000D3K Die in 3000 piece reel
  • MASW-008902-001SMB Sample Board SP3T

应用技术支持与电子电路设计开发资源下载 版本信息 大小
MASW-008902-000DIE 数据资料DataSheet下载:PDF Rev.V2 2 页