MASW-009276-000DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz

The MASW-009276-000DIE is a bumped GaAs pHEMT MMIC SP3T switch. Typical applications are WLAN (802.11 b/g) and Bluetooth applications. The MASW-009276-000DIE delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 GHz. This device is fabricated using a 0.5 micron gate length GaAs pHEMT process. The process features full passivation for performance and reliability. This die features SnAg (2.5%) solder bumps for Wafer Level Chip Scale Package (WLCSP) applications.

技术特性 Features
  • 802.11b/g and Bluetooth Applications
  • Low Insertion Loss:
    0.5 dB 2.4 GHz to 2.5 GHz band
  • High Isolation: 32 dB Typical on RX
  • Low Harmonics: <-70 dBc @ 20 dBm
  • Flip-chip configuration
  • RoHS* Compliant
订购信息 Ordering Information
  • MASW-009276-000D3K Die in 3000 piece reel
  • MASW-009276-001SMB Sample Board SP3T

应用技术支持与电子电路设计开发资源下载 版本信息 大小
MASW-009276-000DIE 数据资料DataSheet下载:PDF Rev.V2 2 页
MASW-009276-000DIE:S 参数   310K