ESD6116:TVS16V
ON Semiconductor’s ESD6116 is an Application Specific Integrated Passive (ASIP) component in a 2 x 2, 4−bump, 0.4 mm pitch, CSP form factor. This device is designed for:
- Transient Voltage Suppression
- Electrostatic Discharge Protection
- Electrical Overstress Protection
技术特性
- 4−Bump, 0.80 mm X 0.80 mm Footprint Chip Scale Package (CSP)
- These Devices are Pb−Free and are RoHS Compliant
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封装图 PACKAGE DIMENSIONS
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订购信息 Ordering Information
| 产品 |
状况 |
Compliance |
具体说明 |
封装 |
MSL* |
容器 |
预算价格 (1千个数量的单价） |
| 类型 |
外形 |
类型 |
数量 |
| ESD6116 |
Active |
|
TVS16V, TVS 16V |
WLCSP-4 |
567CB |
1 |
Die Surf Tape and Reel |
10000 |
$0.1133 |
数据资料DataSheet下载
| 概述 |
文档编号/大小 |
版本 |
| TVS16V |
ESD6116-D(417.0kB) |
1 |
