技术特性

• Low Capacitance (1.5 pF Maximum Between I/O Lines)
  
• Single Package Integration Design
  
• Provides ESD Protection for JEDEC Standards JESD22
  Machine Model = Class C
  Human Body Model = Class 3B
  
• Protection for IEC61000−4−2 (Level 4)
  8.0 kV (Contact)
  15 kV (Air)
  
• Ensures Data Line Speed and Integrity
  
• Fewer Components and Less Board Space
  
• Direct the Transient to Either Positive Side or to the Ground

应用

• USB 1.1 and 2.0 Data Line Protection
• T1/E1 Secondary IC Protection
• T3/E3 Secondary IC Protection
• HDSL, IDSL Secondary IC Protection
• Video Line Protection
• Microcontroller Input Protection
• Base Stations
• I2C Bus Protection

封装图 PACKAGE DIMENSIONS