技术特性

• Diode array topology
• Low capacitance (12 pF typical)
• Lead-free package
• Low capacitance uni-directional ESD protection.
• Low PCB space consuming, 2.5 mm2 max. footprint
• Low leakage current
• High reliability offered by monolithic integration

功能框图

应用领域

• Computers
• Printers
• Communication systems
• Cellular phone handsets and accessories
• Video equipment

Benefits

• Low capacitance uni-directional ESD protection.
• Low PCB space consuming, 2.5 mm2 max. footprint
• Low leakage current
• High reliability offered by monolithic integration

Complies with the following standards:

• IEC 61000-4-2
  – 15 kV (air discharge)
  – 8 kV (contact discharge)
• MIL STD 883G- Method 3015-7: class3B
  – >8 kV (human body model)