技术特性

• Peak pulse power:
  • up to 3 kW (10/1000 μs)
  • up to 22.5 kW (8/20 μs)
• Breakdown voltage range: from 23.1 V to 30 V
• Low clamping factor
• Unidirectional with low VF(VF= 1.2 V at 3 A)
• Low leakage current: 0.2 μA at 25 °C
• Operating Tj max: 150 °C
• Still IEC 61000-4-5 compliant at Tj= 85 °C with standard footprint
• High power capability at Tjmax:
  • 1250 W (10/1000 μs)
• JEDEC registered package outline
• Compatible with LNBH supply and control ICs
• Complies with the following standards
  • IEC 61000-4-2 level 4:
    • 15 kV (air discharge)
    • 8 kV (contact discharge)
  • IEC 61000-4-5
  • MIL STD 883G, method 3015-7: class 3B:
    • 25 kV HBM (human body model)
  • UL 497B file number: QVGQ2.E136224
  • Resin meets UL 94, V0
  • MIL-STD-750, method 2026 solderability
  • EIA STD RS-481 and IEC 60286-3 packing
  • IPC 7531 footprint

Complies with the following standards

• IEC 61000-4-2 level 4:
  – 15 kV (air discharge)
  – 8 kV (contact discharge)
• IEC 61000-4-5
• MIL STD 883G, method 3015-7: class 3B:
  – 25 kV HBM (human body model)
• UL 497B file number: QVGQ2.E136224
• Resin meets UL 94, V0
• MIL-STD-750, method 2026 solderability
• EIA STD RS-481 and IEC 60286-3 packing
• IPC 7531 footprint

功能框图