CY74FCT374T 具有三态输出的八路 D 类寄存器
The \x92FCT374T devices are high-speed, low-power, octal D-type flip-flops, featuring separate D-type inputs for each flip-flop. These devices have 3-state outputs for bus-oriented applications. A buffered clock (CP) and output-enable (OE\) inputs are common to all flip-flops. The eight flip-flops in the \x92FCT374T store the state of their individual D inputs that meet the setup-time and hold-time requirements on the low-to-high CP transition. When OE\ is low, the contents of the eight flip-flops are available at the outputs. When OE\ is high, the outputs are in the high-impedance state. The state of OE\ does not affect the state of the flip-flops.
These devices are fully specified for partial-power-down applications using Ioff
|
CY74FCT374T |
| Voltage Nodes(V) |
5 |
| Technology Family |
FCT |
| Rating |
Catalog |
CY74FCT374T 特性
- Function, Pinout, and Drive Compatible With FCT and F Logic
- Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions
- Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
- Ioff Supports Partial-Power-Down Mode Operation
- Matched Rise and Fall Times
- Fully Compatible With TTL Input and Output Logic Levels
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- Edge-Triggered D-Type Inputs
- 250-MHz Typical Switching Rate
- CY54FCT374T
- 32-mA Output Sink Current
- 12-mA Output Source Current
- CY74FCT374T
- 64-mA Output Sink Current
- 32-mA Output Source Current
- 3-State
CY74FCT374T 芯片订购指南
| 器件 |
状态 |
温度 |
价格（美元） |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| CY74FCT374TPC |
ACTIVE |
-40 to 85 |
0.65 | 1ku |
PDIP (N) | 20 |
20 | TUBE |
|
| CY74FCT374TPCE4 |
ACTIVE |
-40 to 85 |
0.65 | 1ku |
PDIP (N) | 20 |
20 | TUBE |
|
| CY74FCT374TQCT |
ACTIVE |
-40 to 85 |
0.90 | 1ku |
SSOP/QSOP (DBQ) | 20 |
2500 | LARGE T&R |
|
| CY74FCT374TQCTE4 |
ACTIVE |
-40 to 85 |
0.90 | 1ku |
SSOP/QSOP (DBQ) | 20 |
2500 | LARGE T&R |
|
| CY74FCT374TQCTG4 |
ACTIVE |
-40 to 85 |
0.90 | 1ku |
SSOP/QSOP (DBQ) | 20 |
2500 | LARGE T&R |
|
| CY74FCT374TSOC |
ACTIVE |
-40 to 85 |
0.60 | 1ku |
SOIC (DW) | 20 |
25 | TUBE |
|
| CY74FCT374TSOCE4 |
ACTIVE |
-40 to 85 |
0.60 | 1ku |
SOIC (DW) | 20 |
25 | TUBE |
|
| CY74FCT374TSOCG4 |
ACTIVE |
-40 to 85 |
0.60 | 1ku |
SOIC (DW) | 20 |
25 | TUBE |
|
| CY74FCT374TSOCT |
ACTIVE |
-40 to 85 |
0.85 | 1ku |
SOIC (DW) | 20 |
2000 | LARGE T&R |
|
| CY74FCT374TSOCTE4 |
ACTIVE |
-40 to 85 |
0.85 | 1ku |
SOIC (DW) | 20 |
2000 | LARGE T&R |
|
| CY74FCT374TSOCTG4 |
ACTIVE |
-40 to 85 |
0.85 | 1ku |
SOIC (DW) | 20 |
2000 | LARGE T&R |
|
CY74FCT374T 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| CY74FCT374TPC |
Pb-Free (RoHS) |
CU NIPDAU |
N/A for Pkg Type |
CY74FCT374TPC |
CY74FCT374TPC |
| CY74FCT374TPCE4 |
Pb-Free (RoHS) |
CU NIPDAU |
N/A for Pkg Type |
CY74FCT374TPCE4 |
CY74FCT374TPCE4 |
| CY74FCT374TQCT |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CY74FCT374TQCT |
CY74FCT374TQCT |
| CY74FCT374TQCTE4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CY74FCT374TQCTE4 |
CY74FCT374TQCTE4 |
| CY74FCT374TQCTG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CY74FCT374TQCTG4 |
CY74FCT374TQCTG4 |
| CY74FCT374TSOC |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CY74FCT374TSOC |
CY74FCT374TSOC |
| CY74FCT374TSOCE4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CY74FCT374TSOCE4 |
CY74FCT374TSOCE4 |
| CY74FCT374TSOCG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CY74FCT374TSOCG4 |
CY74FCT374TSOCG4 |
| CY74FCT374TSOCT |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CY74FCT374TSOCT |
CY74FCT374TSOCT |
| CY74FCT374TSOCTE4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CY74FCT374TSOCTE4 |
CY74FCT374TSOCTE4 |
| CY74FCT374TSOCTG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CY74FCT374TSOCTG4 |
CY74FCT374TSOCTG4 |
CY74FCT374T 应用技术支持与电子电路设计开发资源下载
- CY74FCT374T 数据资料 dataSheet 下载.PDF
- TI 德州仪器触发器/锁存器/寄存器产品选型与价格 . xls
- Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
- Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
- TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
- Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
- CMOS Power Consumption and CPD Calculation (PDF 89 KB)
- Designing With Logic (PDF 186 KB)
- Live Insertion (PDF 150 KB)
- Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
- Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- LOGIC Pocket Data Book (PDF 6001 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- Logic Cross-Reference (PDF 2938 KB)
