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SN74AHC16374 具有三态输出的 16 位边沿 D 类触发器

The 'AHC16374 devices are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

These devices can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels at the data (D) inputs.

A buffered output-enable (OE\) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly

	SN74AHC16374
Voltage Nodes(V)	5, 3.3
Rating	Catalog

SN74AHC16374 特性

• Members of the Texas Instruments WidebusTM Family
• EPICTM (Enhanced-Performance Implanted CMOS) Process
• Operating Range 2-V to 5.5-V VCC
• 3-State Outputs Drive Bus Lines Directly
• Distributed VCC and GND Pins Minimize High-Speed Switching Noise
• Flow-Through Architecture Optimizes PCB Layout
• Latch-Up Performance Exceeds 250 mA Per JESD 17
• ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
• Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

SN74AHC16374 芯片订购指南

器件	状态	温度	价格（美元）	封装 | 引脚	封装数量 | 封装载体	丝印标记
SN74AHC16374DGGR	ACTIVE	-40 to 85	1.05 | 1ku	TSSOP (DGG) | 48	2000 | LARGE T&R
SN74AHC16374DGVR	ACTIVE	-40 to 85	1.05 | 1ku	TVSOP (DGV) | 48	2000 | LARGE T&R
SN74AHC16374DL	ACTIVE	-40 to 85	1.35 | 1ku	SSOP (DL) | 48	25 | TUBE
SN74AHC16374DLG4	ACTIVE	-40 to 85	1.35 | 1ku	SSOP (DL) | 48	25 | TUBE
SN74AHC16374DLR	ACTIVE	-40 to 85	1.15 | 1ku	SSOP (DL) | 48	1000 | LARGE T&R
SN74AHC16374DLRG4	ACTIVE	-40 to 85	1.15 | 1ku	SSOP (DL) | 48	1000 | LARGE T&R

SN74AHC16374 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
SN74AHC16374DGGR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AHC16374DGGR	SN74AHC16374DGGR
SN74AHC16374DGVR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AHC16374DGVR	SN74AHC16374DGVR
SN74AHC16374DL	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AHC16374DL	SN74AHC16374DL
SN74AHC16374DLG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AHC16374DLG4	SN74AHC16374DLG4
SN74AHC16374DLR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AHC16374DLR	SN74AHC16374DLR
SN74AHC16374DLRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AHC16374DLRG4	SN74AHC16374DLRG4

SN74AHC16374 应用技术支持与电子电路设计开发资源下载

1. SN74AHC16374 数据资料 dataSheet 下载.PDF
2. TI 德州仪器触发器/锁存器/寄存器产品选型与价格 . xls
3. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
4. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
5. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
6. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
7. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
8. Designing With Logic (PDF 186 KB)
9. Live Insertion (PDF 150 KB)
10. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
11. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
12. HiRel Unitrode Power Management Brochure (PDF 206 KB)
13. LOGIC Pocket Data Book (PDF 6001 KB)
14. HiRel Unitrode Power Management Brochure (PDF 206 KB)
15. Logic Cross-Reference (PDF 2938 KB)