SN74AUC1G14-EP 增强型产品单路施密特触发反向器
This single Schmitt-trigger inverter is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.
The SN74AUC1G14 contains one inverter and performs the Boolean function Y = A. The device functions as an independent inverter, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT-) signals.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
For more information about AUC Little Logic devices, please refer to the TI application report, Applications of Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027
|
SN74AUC1G14-EP |
| Pin/Package |
5SOT-23 |
| Operating Temperature Range(°C) |
-55 to 125 |
| IOL(mA) |
0.7,3,5,8,9, |
| IOH(mA) |
-0.7,-3,-5,-8,-9 |
| Technology Family |
AUC |
| tpd max(ns) |
5.8,5.5,4.5,4,2 |
| ICC(uA) |
10 |
| Rating |
HiRel Enhanced Product |
SN74AUC1G14-EP 特性
- Controlled Baseline
- One Assembly/Test Site, One Fabrication Site
- Extended Temperature Performance of -55°C to 125°C
- Enhanced Diminishing Manufacturing Sources (DMS) Support
- Enhanced Product-Change Notification
- Qualification Pedigree(1)
- Available in the Texas Instruments NanoStar™ and NanoFree™ Packages
- Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- Ioff Supports Partial-Power-Down Mode Operation
- Sub-1-V Operable
- Max tpd of 2.5 ns at 1.8 V
- Low Power Consumption, 10-µA Max ICC
- ±8-mA Output Drive at 1.8 V
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
SN74AUC1G14-EP 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| SN74AUC1G14MDBVREP |
ACTIVE |
-40 to 125 |
0.70 | 1ku |
SOT-23 (DBV) | 5 |
3000 | LARGE T&R |
|
SN74AUC1G14-EP 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| SN74AUC1G14MDBVREP |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74AUC1G14MDBVREP |
SN74AUC1G14MDBVREP |
SN74AUC1G14-EP 应用技术支持与电子电路设计开发资源下载
- SN74AUC1G14-EP 数据资料 dataSheet 下载.PDF
- TI 德州仪器小尺寸逻辑器件产品选型与价格 . xls
- Logic Guide 2009 (PDF 4263 KB)
- Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
- Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
- TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
- Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
- CMOS Power Consumption and CPD Calculation (PDF 89 KB)
- Designing With Logic (PDF 186 KB)
- Live Insertion (PDF 150 KB)
- Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
- Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- LOGIC Pocket Data Book (PDF 6001 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- Logic Cross-Reference (PDF 2938 KB)
