SN74AUP1G99 具有三态输出的低功耗超级可配置多功能门

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see Figures 1 and 2).

The SN74AUP1G99 features configurable multiple functions with a 3-state output. This device has the input-disable feature, which allows floating input signals. The inputs and output are disabled when the output-enable (OE) input is high. When OE is low, the output state is determined by 16 patterns of 4-bit input. The user can choose the logic functions, such as MUX, AND, OR, NAND, NOR, XOR, XNOR, inverter, and buffer. All inputs can be connected to VCC or GND.

This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching noise immunity at the input.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down

SN74AUP1G99
tpd max(ns) 7.4  
Pin/Package 8DSBGA, 8SM8, 8US8  
IOH(mA) -4  
IOL(mA) 4  
Vcc min(V) 0.8  
Vcc max(V) 3.6  
Performance 0.26 | 1ku  
Approx. Price (US$) -40 to 85  
Operating Temperature Range(°C) AUP  
Technology Family 1  
ICC(uA) 0.9  
Rating Catalog
SN74AUP1G99 特性
SN74AUP1G99 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN74AUP1G99DCTR ACTIVE -40 to 85 0.26 | 1ku SM8 (DCT) | 8 3000 | LARGE T&R  
SN74AUP1G99DCTRE4 ACTIVE -40 to 85 0.26 | 1ku SM8 (DCT) | 8 3000 | LARGE T&R  
SN74AUP1G99DCTRG4 ACTIVE -40 to 85 0.26 | 1ku SM8 (DCT) | 8 3000 | LARGE T&R  
SN74AUP1G99DCTT ACTIVE -40 to 85 0.60 | 1ku SM8 (DCT) | 8 250 | SMALL T&R  
SN74AUP1G99DCTTE4 ACTIVE -40 to 85 0.60 | 1ku SM8 (DCT) | 8 250 | SMALL T&R  
SN74AUP1G99DCTTG4 ACTIVE -40 to 85 0.60 | 1ku SM8 (DCT) | 8 250 | SMALL T&R  
SN74AUP1G99DCUR ACTIVE -40 to 85 0.26 | 1ku US8 (DCU) | 8 3000 | LARGE T&R  
SN74AUP1G99DCURE4 ACTIVE -40 to 85 0.26 | 1ku US8 (DCU) | 8 3000 | LARGE T&R  
SN74AUP1G99DCURG4 ACTIVE -40 to 85 0.26 | 1ku US8 (DCU) | 8 3000 | LARGE T&R  
SN74AUP1G99DCUT ACTIVE -40 to 85 0.60 | 1ku US8 (DCU) | 8 250 | SMALL T&R  
SN74AUP1G99DCUTE4 ACTIVE -40 to 85 0.60 | 1ku US8 (DCU) | 8 250 | SMALL T&R  
SN74AUP1G99DCUTG4 ACTIVE -40 to 85 0.60 | 1ku US8 (DCU) | 8 250 | SMALL T&R  
SN74AUP1G99YZPR ACTIVE -40 to 85 0.40 | 1ku DSBGA (YZD) | 8 3000 | LARGE T&R  
SN74AUP1G99 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN74AUP1G99DCTR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G99DCTR SN74AUP1G99DCTR
SN74AUP1G99DCTRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G99DCTRE4 SN74AUP1G99DCTRE4
SN74AUP1G99DCTRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G99DCTRG4 SN74AUP1G99DCTRG4
SN74AUP1G99DCTT Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G99DCTT SN74AUP1G99DCTT
SN74AUP1G99DCTTE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G99DCTTE4 SN74AUP1G99DCTTE4
SN74AUP1G99DCTTG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G99DCTTG4 SN74AUP1G99DCTTG4
SN74AUP1G99DCUR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G99DCUR SN74AUP1G99DCUR
SN74AUP1G99DCURE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G99DCURE4 SN74AUP1G99DCURE4
SN74AUP1G99DCURG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G99DCURG4 SN74AUP1G99DCURG4
SN74AUP1G99DCUT Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G99DCUT SN74AUP1G99DCUT
SN74AUP1G99DCUTE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G99DCUTE4 SN74AUP1G99DCUTE4
SN74AUP1G99DCUTG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G99DCUTG4 SN74AUP1G99DCUTG4
SN74AUP1G99YZPR Green (RoHS & no Sb/Br)  SNAGCU  Level-1-260C-UNLIM SN74AUP1G99YZPR SN74AUP1G99YZPR
SN74AUP1G99 应用技术支持与电子电路设计开发资源下载
  1. SN74AUP1G99 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器小尺寸逻辑器件产品选型与价格 . xls
  3. Logic Guide 2009 (PDF 4263 KB)
  4. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  9. Designing With Logic (PDF 186 KB)
  10. Live Insertion (PDF 150 KB)
  11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  14. LOGIC Pocket Data Book (PDF 6001 KB)
  15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  16. Logic Cross-Reference (PDF 2938 KB)