The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see Figure 1 and Figure 2).
The SN74AUP2G126 is a dual bus driver/line driver with 3-state outputs, designed for 0.8-V to 3.6-V VCC operation. The outputs are disabled when the associated output-enable (OE) input is low. This device has the input-disable feature, which allows floating input signals.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down
| SN74AUP2G126 | |
| Pin/Package | 8DSBGA, 8US8, 8UQFN, 8X2SON |
| Operating Temperature Range(°C) | -40 to 85 |
| IOL(mA) | 4 |
| IOH(mA) | -4 |
| Vcc max(V) | 3.6 |
| Technology Family | AUP |
| Vcc min(V) | 0.8 |
| Approx. Price (US$) | 0.23 | 1ku |
| No. of Gates | 4 |
| tpd max(ns) | 9.9 |
| ICC(uA) | 0.9 |
| Voltage Node(V) | 3.3 |
| Rating | Catalog |
| 器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| SN74AUP2G126DCUR | ACTIVE | -40 to 85 | 0.24 | 1ku | US8 (DCU) | 8 | 3000 | LARGE T&R | |
| SN74AUP2G126DQER | ACTIVE | -40 to 85 | 0.23 | 1ku | X2SON (DQE) | 8 | 5000 | LARGE T&R | |
| SN74AUP2G126RSER | ACTIVE | -40 to 85 | 0.24 | 1ku | UQFN (RSE) | 8 | 5000 | LARGE T&R | |
| SN74AUP2G126YFPR | ACTIVE | -40 to 85 | 0.33 | 1ku | DSBGA (YFP) | 8 | 3000 | LARGE T&R | |
| SN74AUP2G126YZPR | ACTIVE | -40 to 85 | 0.35 | 1ku | DSBGA (YZP) | 8 | 3000 | LARGE T&R |
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| SN74AUP2G126DCUR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74AUP2G126DCUR | SN74AUP2G126DCUR |
| SN74AUP2G126DQER | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | SN74AUP2G126DQER | SN74AUP2G126DQER |
| SN74AUP2G126RSER | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74AUP2G126RSER | SN74AUP2G126RSER |
| SN74AUP2G126YFPR | Green (RoHS & no Sb/Br) | SNAGCU | Level-1-260C-UNLIM | SN74AUP2G126YFPR | SN74AUP2G126YFPR |
| SN74AUP2G126YZPR | Green (RoHS & no Sb/Br) | SNAGCU | Level-1-260C-UNLIM | SN74AUP2G126YZPR | SN74AUP2G126YZPR |
