SN74AUP2G79 低功耗单路上升沿 D 类触发器
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see Figure 1 and Figure 2).
This is a single positive-edge-triggered D-type flip-flop. When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs
|
SN74AUP2G79 |
| Pin/Package |
5DSBGA, 5SC70, 5SOT, 5SOT-23, 6DSBGA, 6SON |
| Operating Temperature Range(°C) |
-40 to 85 |
| Voltage Nodes(V) |
3.3 |
| Logic |
True |
| No. of Bits |
1 |
| Static Current |
0.0005 |
| Output Drive(mA) |
-4,4 |
| Vcc max(V) |
3.6 |
| Technology Family |
AUP |
| Vcc min(V) |
0.8 |
| Approx. Price (US$) |
0.13 | 1ku |
| th(ns) |
0 |
| tsu(ns) |
1 |
| No. of Outputs |
1 |
| Vcc range(V) |
0.8 to 3.6 |
| tpd max(ns) |
4 |
| ICC(uA) |
0.9 |
| Rating |
Catalog |
SN74AUP2G79 特性
- Available in the Texas Instruments NanoStar™ Package
- Low Static-Power Consumption:
ICC = 0.9 µA Max
- Low Dynamic-Power Consumption:
Cpd = 3 pF Typ at 3.3 V
- Low Input Capacitance:
Ci = 1.5 pF Typ
- Low Noise: Overshoot and Undershoot <10% of VCC
- Ioff Supports Partial Power-Down-Mode Operation
- Input Hysteresis Allows Slow Input Transition and Better Switching
Noise Immunity at the Input (Vhys = 250 mV Typ at 3.3 V)
- Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- tpd = 4 ns Max at 3.3 V
- Suitable for Point-to-Point Applications
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
(A114-B, Class II)
- 1000-V Charged-Device Model (C101)
SN74AUP2G79 芯片订购指南
| 器件 |
状态 |
温度 |
价格（美元） |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| SN74AUP2G79DBVR |
ACTIVE |
-40 to 85 |
0.13 | 1ku |
SOT-23 (DBV) | 5 |
3000 | LARGE T&R |
|
| SN74AUP2G79DBVRE4 |
ACTIVE |
-40 to 85 |
0.13 | 1ku |
SOT-23 (DBV) | 5 |
3000 | LARGE T&R |
|
| SN74AUP2G79DBVRG4 |
ACTIVE |
-40 to 85 |
0.13 | 1ku |
SOT-23 (DBV) | 5 |
3000 | LARGE T&R |
|
| SN74AUP2G79DBVT |
ACTIVE |
-40 to 85 |
0.46 | 1ku |
SOT-23 (DBV) | 5 |
250 | SMALL T&R |
|
| SN74AUP2G79DBVTE4 |
ACTIVE |
-40 to 85 |
0.46 | 1ku |
SOT-23 (DBV) | 5 |
250 | SMALL T&R |
|
| SN74AUP2G79DBVTG4 |
ACTIVE |
-40 to 85 |
0.46 | 1ku |
SOT-23 (DBV) | 5 |
250 | SMALL T&R |
|
| SN74AUP2G79DCKR |
ACTIVE |
-40 to 85 |
0.13 | 1ku |
SC70 (DCK) | 5 |
3000 | LARGE T&R |
|
| SN74AUP2G79DCKRE4 |
ACTIVE |
-40 to 85 |
0.13 | 1ku |
SC70 (DCK) | 5 |
3000 | LARGE T&R |
|
| SN74AUP2G79DCKRG4 |
ACTIVE |
-40 to 85 |
0.13 | 1ku |
SC70 (DCK) | 5 |
3000 | LARGE T&R |
|
| SN74AUP2G79DCKT |
ACTIVE |
-40 to 85 |
0.46 | 1ku |
SC70 (DCK) | 5 |
250 | SMALL T&R |
|
| SN74AUP2G79DCKTE4 |
ACTIVE |
-40 to 85 |
0.46 | 1ku |
SC70 (DCK) | 5 |
250 | SMALL T&R |
|
| SN74AUP2G79DCKTG4 |
ACTIVE |
-40 to 85 |
0.46 | 1ku |
SC70 (DCK) | 5 |
250 | SMALL T&R |
|
| SN74AUP2G79DRLR |
ACTIVE |
-40 to 85 |
0.16 | 1ku |
SOT (DRL) | 5 |
4000 | LARGE T&R |
|
| SN74AUP2G79DRLRG4 |
ACTIVE |
-40 to 85 |
0.16 | 1ku |
SOT (DRL) | 5 |
4000 | LARGE T&R |
|
| SN74AUP2G79DRYR |
ACTIVE |
-40 to 85 |
0.15 | 1ku |
SON (DRY) | 6 |
5000 | LARGE T&R |
|
| SN74AUP2G79DSFR |
ACTIVE |
-40 to 85 |
0.14 | 1ku |
SON (DSF) | 6 |
5000 | LARGE T&R |
|
| SN74AUP2G79YFPR |
ACTIVE |
|
0.24 | 1ku |
DSBGA (YFF) | 6 |
3000 | LARGE T&R |
|
| SN74AUP2G79YZPR |
ACTIVE |
-40 to 85 |
0.26 | 1ku |
DSBGA (YZU) | 5 |
3000 | LARGE T&R |
|
SN74AUP2G79 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| SN74AUP2G79DBVR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74AUP2G79DBVR |
SN74AUP2G79DBVR |
| SN74AUP2G79DBVRE4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74AUP2G79DBVRE4 |
SN74AUP2G79DBVRE4 |
| SN74AUP2G79DBVRG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74AUP2G79DBVRG4 |
SN74AUP2G79DBVRG4 |
| SN74AUP2G79DBVT |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74AUP2G79DBVT |
SN74AUP2G79DBVT |
| SN74AUP2G79DBVTE4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74AUP2G79DBVTE4 |
SN74AUP2G79DBVTE4 |
| SN74AUP2G79DBVTG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74AUP2G79DBVTG4 |
SN74AUP2G79DBVTG4 |
| SN74AUP2G79DCKR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74AUP2G79DCKR |
SN74AUP2G79DCKR |
| SN74AUP2G79DCKRE4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74AUP2G79DCKRE4 |
SN74AUP2G79DCKRE4 |
| SN74AUP2G79DCKRG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74AUP2G79DCKRG4 |
SN74AUP2G79DCKRG4 |
| SN74AUP2G79DCKT |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74AUP2G79DCKT |
SN74AUP2G79DCKT |
| SN74AUP2G79DCKTE4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74AUP2G79DCKTE4 |
SN74AUP2G79DCKTE4 |
| SN74AUP2G79DCKTG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74AUP2G79DCKTG4 |
SN74AUP2G79DCKTG4 |
| SN74AUP2G79DRLR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74AUP2G79DRLR |
SN74AUP2G79DRLR |
| SN74AUP2G79DRLRG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74AUP2G79DRLRG4 |
SN74AUP2G79DRLRG4 |
| SN74AUP2G79DRYR |
Green (RoHS & no Sb/Br) |
NIPDAU |
Level-1-260C-UNLIM |
SN74AUP2G79DRYR |
SN74AUP2G79DRYR |
| SN74AUP2G79DSFR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74AUP2G79DSFR |
SN74AUP2G79DSFR |
| SN74AUP2G79YFPR |
Green (RoHS & no Sb/Br) |
SNAGCU |
Level-1-260C-UNLIM |
SN74AUP2G79YFPR |
SN74AUP2G79YFPR |
| SN74AUP2G79YZPR |
Green (RoHS & no Sb/Br) |
SNAGCU |
Level-1-260C-UNLIM |
SN74AUP2G79YZPR |
SN74AUP2G79YZPR |
SN74AUP2G79 应用技术支持与电子电路设计开发资源下载
- SN74AUP2G79 数据资料 dataSheet 下载.PDF
- TI 德州仪器触发器/锁存器/寄存器产品选型与价格 . xls
- Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
- Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
- TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
- Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
- CMOS Power Consumption and CPD Calculation (PDF 89 KB)
- Designing With Logic (PDF 186 KB)
- Live Insertion (PDF 150 KB)
- Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
- Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- LOGIC Pocket Data Book (PDF 6001 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- Logic Cross-Reference (PDF 2938 KB)
