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SN74AUP3G04 低功耗三路反向器闸

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

The SN74AUP3G04 performs the Boolean function Y = A in positive logic.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down

	SN74AUP3G04
Pin/Package	8DSBGA, 8UQFN, 8US8, 8X2SON
Operating Temperature Range(°C)	-40 to 85
IOL(mA)	4
IOH(mA)	-4
Vcc max(V)	3.6
Technology Family	AUP
Vcc min(V)	0.8
Approx. Price (US$)	0.23 | 1ku
No. of Gates	3
tpd max(ns)	4.3
ICC(uA)	0.9
Rating	Catalog

SN74AUP3G04 特性

• Available in the Texas Instruments NanoStar™ Package
• Low Static-Power Consumption (ICC = 0.9 µA Maximum)
• Low Dynamic-Power Consumption (Cpd = 4.3 pF Typ at 3.3 V)
• Low Input Capacitance (Ci = 1.5 pF Typical)
• Low Noise – Overshoot and Undershoot <10% of VCC
• Ioff Supports Partial-Power-Down Mode Operation
• Wide Operating VCC Range of 0.8 V to 3.6 V
• Optimized for 3.3-V Operation
• 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
• tpd = 4.3 ns Maximum at 3.3 V
• Suitable for Point-to-Point Applications
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Performance Tested Per JESD 22
  • 2000-V Human-Body Model (A114-B, Class II)
  • 1000-V Charged-Device Model (C101)

SN74AUP3G04 芯片订购指南

器件	状态	温度	价格	封装 | 引脚	封装数量 | 封装载体	丝印标记
SN74AUP3G04DCUR	ACTIVE	-40 to 85	0.24 | 1ku	US8 (DCU) | 8	3000 | LARGE T&R
SN74AUP3G04DQER	ACTIVE	-40 to 85	0.23 | 1ku	X2SON (DQE) | 8	5000 | LARGE T&R
SN74AUP3G04RSER	ACTIVE	-40 to 85	0.24 | 1ku	UQFN (RSE) | 8	5000 | LARGE T&R
SN74AUP3G04YFPR	ACTIVE	-40 to 85	0.33 | 1ku	DSBGA (YZD) | 8	3000 | LARGE T&R

SN74AUP3G04 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
SN74AUP3G04DCUR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP3G04DCUR	SN74AUP3G04DCUR
SN74AUP3G04DQER	Green (RoHS & no Sb/Br)	NIPDAU	Level-1-260C-UNLIM	SN74AUP3G04DQER	SN74AUP3G04DQER
SN74AUP3G04RSER	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP3G04RSER	SN74AUP3G04RSER
SN74AUP3G04YFPR	Green (RoHS & no Sb/Br)	SNAGCU	Level-1-260C-UNLIM	SN74AUP3G04YFPR	SN74AUP3G04YFPR

SN74AUP3G04 应用技术支持与电子电路设计开发资源下载

1. SN74AUP3G04 数据资料 dataSheet 下载.PDF
2. TI 德州仪器小尺寸逻辑器件产品选型与价格 . xls
3. Logic Guide 2009 (PDF 4263 KB)
4. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
9. Designing With Logic (PDF 186 KB)
10. Live Insertion (PDF 150 KB)
11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
14. LOGIC Pocket Data Book (PDF 6001 KB)
15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
16. Logic Cross-Reference (PDF 2938 KB)