SN74AVC16646 具有三态输出的 16 位总线收发器和寄存器
SN74AVC16646 描述
A Dynamic Output Control (DOC) circuit is implemented, which, during the transition, initially lowers the output impedance to effectively drive the load and, subsequently, raises the impedance to reduce noise. Figure 1 shows typical VOL vs IOL and VOH vs IOH curves to illustrate the output impedance and drive capability of the circuit. At the beginning of the signal transition, the DOC circuit provides a maximum dynamic drive that is equivalent to a high-drive standard-output device. For more information, refer to the TI application reports, AVC Logic Family Technology and Applications, literature number SCEA006, and Dynamic Output Control (DOCTM) Circuitry Technology and Applications, literature number SCEA009.
|
SN74AVC16646 |
| Voltage Nodes(V) |
3.3, 2.5, 1.8, 1.5, 1.2 |
| Vcc range(V) |
1.2 to 3.6 |
| Output Drive(mA) |
-12/12 |
| No. of Outputs |
16 |
| No. of Bits |
16 |
| Logic |
True |
| Static Current |
0.04 |
| th(ns) |
1.3 |
| tpd max(ns) |
10 |
| tsu(ns) |
2.1 |
| Technology Family |
AVC |
| Rating |
Catalog |
SN74AVC16646 特性
- Member of the Texas Instruments WidebusTM Family
- EPICTM (Enhanced-Performance Implanted CMOS) Submicron Process
- DOCTM (Dynamic Output Control) Circuit Dynamically Changes Output Impedance, Resulting in Noise Reduction Without Speed Degradation
- Dynamic Drive Capability Is Equivalent to Standard Outputs With IOH and IOL of ±24 mA at 2.5-V VCC
- Overvoltage-Tolerant Inputs/Outputs Allow Mixed-Voltage-Mode Data Communications
- Ioff Supports Partial-Power-Down Mode Operation
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- Package Options Include Plastic Thin Shrink Small-Outline (DGG) and Thin Very Small-Outline (DGV) Packages
SN74AVC16646 芯片订购指南
| 器件 |
状态 |
温度 |
价格（美元） |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| SN74AVC16646DGGR |
ACTIVE |
-40 to 85 |
3.30 | 1ku |
TSSOP (DGG) | 56 |
2000 | LARGE T&R |
AVC16646 |
| SN74AVC16646DGVR |
ACTIVE |
-40 to 85 |
3.30 | 1ku |
TVSOP (DGV) | 56 |
2000 | LARGE T&R |
CVA646 |
SN74AVC16646 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| SN74AVC16646DGGR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74AVC16646DGGR |
SN74AVC16646DGGR |
| SN74AVC16646DGVR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74AVC16646DGVR |
SN74AVC16646DGVR |
SN74AVC16646 应用技术支持与电子电路设计开发资源下载
- SN74AVC16646 数据资料 dataSheet 下载.PDF
- TI 德州仪器缓冲器、驱动器/收发器产品选型与价格 . xls
- CMOS 非缓冲反向器在振荡器电路中的使用 (PDF 951 KB)
- Semiconductor Packing Methodology (PDF 3005 KB)
- 逻辑产品选择指南 2006/2007 （修订版 Z）(4462KB)
- 标准线性和逻辑产品 5 分钟指南 (786KB)
- 了解和解释标准逻辑数据表
- LOGIC Pocket Data Book (PDF 6001 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- Logic Cross-Reference (PDF 2938 KB)
