SN74HC164 | |
Technology Family | HC |
Rating | Catalog |
器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
SN74HC164D | ACTIVE | 0 to 70 | 0.65 | 1ku | SOIC (D) | 14 | 40 | TUBE | |
SN74HC164DE4 | ACTIVE | 0 to 70 | 0.65 | 1ku | SOIC (D) | 14 | 40 | TUBE | |
SN74HC164DG4 | ACTIVE | 0 to 70 | 0.65 | 1ku | SOIC (D) | 14 | 40 | TUBE | |
SN74HC164DR | ACTIVE | 0 to 70 | 0.55 | 1ku | SOIC (D) | 14 | 2500 | LARGE T&R | |
SN74HC164DRE4 | ACTIVE | 0 to 70 | 0.55 | 1ku | SOIC (D) | 14 | 2500 | LARGE T&R | |
SN74HC164DRG4 | ACTIVE | 0 to 70 | 0.55 | 1ku | SOIC (D) | 14 | 2500 | LARGE T&R | |
SN74HC164N | ACTIVE | 0 to 70 | 0.60 | 1ku | PDIP (N) | 14 | 25 | TUBE | SN74HC164N |
SN74HC164NE4 | ACTIVE | 0 to 70 | 1.60 | 1ku | PDIP (N) | 14 | 25 | TUBE | SN74HC164N |
器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
SN74HC164D | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74HC164D | SN74HC164D |
SN74HC164DE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74HC164DE4 | SN74HC164DE4 |
SN74HC164DG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74HC164DG4 | SN74HC164DG4 |
SN74HC164DR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74HC164DR | SN74HC164DR |
SN74HC164DRE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74HC164DRE4 | SN74HC164DRE4 |
SN74HC164DRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74HC164DRG4 | SN74HC164DRG4 |
SN74HC164N | Pb-Free (RoHS) | CU NIPDAU | N/A for Pkg Type | SN74HC164N | SN74HC164N |
SN74HC164NE4 | Pb-Free (RoHS) | CU NIPDAU | N/A for Pkg Type | SN74HC164NE4 | SN74HC164NE4 |