SN74HCT574 具有三态输出的八路 D 类边沿触发器

These octal edge-triggered D-type flip-flops feature 3-state outputs designed specifically for bus driving. The ’HCT574 devices are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The eight flip-flops enter data on the low-to-high transition of the clock (CLK) input.

A buffered output-enable (OE)\ input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components

SN74HCT574
Voltage Nodes(V) 5  
Vcc range(V) 4.5 to 5.5  
Input Level TTL  
Output Level CMOS  
Output Drive(mA) -6/6  
No. of Outputs 8  
th(ns) 5  
tpd max(ns) 41  
tsu(ns) 23  
Logic True  
Technology Family HCT  
Rating Catalog
SN74HCT574 特性
SN74HCT574 芯片订购指南
器件 状态 温度 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN74HCT574DW ACTIVE 0 to 70 1.10 | 1ku SOIC (DW) | 20 25 | TUBE HCT574
SN74HCT574DWE4 ACTIVE 0 to 70 1.10 | 1ku SOIC (DW) | 20 25 | TUBE HCT574
SN74HCT574DWG4 ACTIVE 0 to 70 0.90 | 1ku SOIC (DW) | 20 2000 | LARGE T&R HCT574
SN74HCT574DWR ACTIVE 0 to 70 0.90 | 1ku SOIC (DW) | 20 2000 | LARGE T&R HCT574
SN74HCT574DWRE4 ACTIVE 0 to 70 0.90 | 1ku SOIC (DW) | 20 2000 | LARGE T&R HCT574
SN74HCT574DWRG4 ACTIVE 0 to 70 0.90 | 1ku SOIC (DW) | 20 2000 | LARGE T&R HCT574
SN74HCT574N ACTIVE 0 to 70 1.00 | 1ku PDIP (N) | 20 20 | TUBE SN74HCT574N
SN74HCT574N3 OBSOLETE 0 to 70   PDIP (N) | 20   SN74HCT574N
SN74HCT574NE4 ACTIVE 0 to 70 1.00 | 1ku PDIP (N) | 20 20 | TUBE SN74HCT574N
SN74HCT574NSR ACTIVE 0 to 70 1.00 | 1ku SO (NS) | 20 2000 | LARGE T&R HCT574
SN74HCT574NSRE4 ACTIVE 0 to 70 1.00 | 1ku SO (NS) | 20 2000 | LARGE T&R HCT574
SN74HCT574NSRG4 ACTIVE 0 to 70 1.00 | 1ku SO (NS) | 20 2000 | LARGE T&R HCT574
SN74HCT574 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN74HCT574DW Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74HCT574DW SN74HCT574DW
SN74HCT574DWE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74HCT574DWE4 SN74HCT574DWE4
SN74HCT574DWG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74HCT574DWG4 SN74HCT574DWG4
SN74HCT574DWR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74HCT574DWR SN74HCT574DWR
SN74HCT574DWRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74HCT574DWRE4 SN74HCT574DWRE4
SN74HCT574DWRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74HCT574DWRG4 SN74HCT574DWRG4
SN74HCT574N Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74HCT574N SN74HCT574N
SN74HCT574N3 Pb-Free (RoHS)  CU NIPDAU  N/A for Pkg Type SN74HCT574N3 SN74HCT574N3
SN74HCT574NE4 Pb-Free (RoHS)  CU NIPDAU  N/A for Pkg Type SN74HCT574NE4 SN74HCT574NE4
SN74HCT574NSR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74HCT574NSR SN74HCT574NSR
SN74HCT574NSRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74HCT574NSRE4 SN74HCT574NSRE4
SN74HCT574NSRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74HCT574NSRG4 SN74HCT574NSRG4
SN74HCT574 应用技术支持与电子电路设计开发资源下载
  1. SN74HCT574 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器触发器/锁存器/寄存器产品选型与价格 . xls
  3. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  4. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  5. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  6. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  7. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  8. Designing With Logic (PDF 186 KB)
  9. Live Insertion (PDF 150 KB)
  10. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  11. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  12. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  13. LOGIC Pocket Data Book (PDF 6001 KB)
  14. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  15. Logic Cross-Reference (PDF 2938 KB)