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SN74LVC1G27 单路 3 输入正或非门

The SN74LVC1G27 performs the Boolean function Y = A + B + C or Y = A • B • C in positive logic.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down

	SN74LVC1G27
Pin/Package	6DSBGA, 6SC70, 6SOT-23
Operating Temperature Range(°C)	-40 to 85
IOL(mA)	32
IOH(mA)	-32
Vcc max(V)	5.5
Technology Family	LVC
Vcc min(V)	1.65
Approx. Price (US$)	0.13 | 1ku
No. of Gates	1
tpd max(ns)	3.6
ICC(uA)	10
Rating	Catalog

SN74LVC1G27 特性

• Available in the Texas Instruments NanoFree™ Package
• Supports 5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• Max tpd of 4.5 ns at 3.3 V
• Low Power Consumption, 10-µA Max ICC
• ±24-mA Output Drive at 3.3 V
• Ioff Supports Partial-Power-Down Mode Operation
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Protection Exceeds JESD 22
  • 2000-V Human-Body Model (A114-A)
  • 200-V Machine Model (A115-A)
  • 1000-V Charged-Device Model (C101)

SN74LVC1G27 芯片订购指南

器件	状态	温度	价格	封装 | 引脚	封装数量 | 封装载体	丝印标记
SN74LVC1G27DBVR	ACTIVE	-40 to 85	0.13 | 1ku	SOT-23 (DBV) | 6	3000 | LARGE T&R
SN74LVC1G27DBVRE4	ACTIVE	-40 to 85	0.13 | 1ku	SOT-23 (DBV) | 6	3000 | LARGE T&R
SN74LVC1G27DBVRG4	ACTIVE	-40 to 85	0.13 | 1ku	SOT-23 (DBV) | 6	3000 | LARGE T&R
SN74LVC1G27DCKR	ACTIVE	-40 to 85	0.13 | 1ku	SC70 (DCK) | 6	3000 | LARGE T&R
SN74LVC1G27DCKRE4	ACTIVE	-40 to 85	0.13 | 1ku	SC70 (DCK) | 6	3000 | LARGE T&R
SN74LVC1G27DCKRG4	ACTIVE	-40 to 85	0.13 | 1ku	SC70 (DCK) | 6	3000 | LARGE T&R
SN74LVC1G27YZPR	ACTIVE	-40 to 85	0.26 | 1ku	DSBGA (YFF) | 6	3000 | LARGE T&R

SN74LVC1G27 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
SN74LVC1G27DBVR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LVC1G27DBVR	SN74LVC1G27DBVR
SN74LVC1G27DBVRE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LVC1G27DBVRE4	SN74LVC1G27DBVRE4
SN74LVC1G27DBVRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LVC1G27DBVRG4	SN74LVC1G27DBVRG4
SN74LVC1G27DCKR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LVC1G27DCKR	SN74LVC1G27DCKR
SN74LVC1G27DCKRE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LVC1G27DCKRE4	SN74LVC1G27DCKRE4
SN74LVC1G27DCKRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LVC1G27DCKRG4	SN74LVC1G27DCKRG4
SN74LVC1G27YZPR	Green (RoHS & no Sb/Br)	SNAGCU	Level-1-260C-UNLIM	SN74LVC1G27YZPR	SN74LVC1G27YZPR

SN74LVC1G27 应用技术支持与电子电路设计开发资源下载

1. SN74LVC1G27 数据资料 dataSheet 下载.PDF
2. TI 德州仪器门电路产品选型与价格 . xls
3. Logic Guide 2009 (PDF 4263 KB)
4. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
9. Designing With Logic (PDF 186 KB)
10. Live Insertion (PDF 150 KB)
11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
14. LOGIC Pocket Data Book (PDF 6001 KB)
15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
16. Logic Cross-Reference (PDF 2938 KB)