This single D-type latch is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G374 features a 3-state output designed specifically for driving highly capacitive or relatively low-impedance loads. This device is particularly suitable for implementing buffer registers, input/output (I/O) ports, bidirectional bus drivers, and working registers.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
On the positive transition of the clock (CLK) input, the Q output is set to the logic level set up at the data (D) input.
A buffered output-enable (OE) input can be used to place the output in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the output neither loads nor drives the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components.
OE does not affect the internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down
| SN74LVC1G374 | |
| Pin/Package | 6DSBGA, 6SC70, 6SOT-23 |
| Operating Temperature Range(°C) | -40 to 85 |
| IOL(mA) | 32 |
| IOH(mA) | -32 |
| Vcc max(V) | 5.5 |
| Technology Family | LVC |
| Vcc min(V) | 1.65 |
| Approx. Price (US$) | 0.13 | 1ku |
| No. of Gates | 1 |
| tpd max(ns) | 3 |
| ICC(uA) | 10 |
| Rating | Catalog |
| 器件 | 状态 | 温度 | 价格（美元） | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| 74LVC1G374DBVRE4 | ACTIVE | -40 to 85 | 0.13 | 1ku | SOT-23 (DBV) | 6 | 3000 | LARGE T&R | |
| 74LVC1G374DBVRG4 | ACTIVE | -40 to 85 | 0.13 | 1ku | SOT-23 (DBV) | 6 | 3000 | LARGE T&R | |
| 74LVC1G374DCKRE4 | ACTIVE | -40 to 85 | 0.13 | 1ku | SC70 (DCK) | 6 | 3000 | LARGE T&R | |
| 74LVC1G374DCKRG4 | ACTIVE | -40 to 85 | 0.13 | 1ku | SC70 (DCK) | 6 | 3000 | LARGE T&R | |
| SN74LVC1G374DBVR | ACTIVE | -40 to 85 | 0.13 | 1ku | SOT-23 (DBV) | 6 | 3000 | LARGE T&R | |
| SN74LVC1G374DCKR | ACTIVE | -40 to 85 | 0.13 | 1ku | SC70 (DCK) | 6 | 3000 | LARGE T&R | |
| SN74LVC1G374YZPR | ACTIVE | -40 to 85 | 0.26 | 1ku | DSBGA (YFF) | 6 | 3000 | LARGE T&R |
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| 74LVC1G374DBVRE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | 74LVC1G374DBVRE4 | 74LVC1G374DBVRE4 |
| 74LVC1G374DBVRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | 74LVC1G374DBVRG4 | 74LVC1G374DBVRG4 |
| 74LVC1G374DCKRE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | 74LVC1G374DCKRE4 | 74LVC1G374DCKRE4 |
| 74LVC1G374DCKRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | 74LVC1G374DCKRG4 | 74LVC1G374DCKRG4 |
| SN74LVC1G374DBVR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LVC1G374DBVR | SN74LVC1G374DBVR |
| SN74LVC1G374DCKR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LVC1G374DCKR | SN74LVC1G374DCKR |
| SN74LVC1G374YZPR | Green (RoHS & no Sb/Br) | SNAGCU | Level-1-260C-UNLIM | SN74LVC1G374YZPR | SN74LVC1G374YZPR |
