SN74LVTH162240-EP 具有三态输出的增强型产品 3.3V Abt 16 位缓冲器/驱动器

The SN74LVTH162240 is a 16-bit buffer/driver designed specifically for low-voltage (3.3-V) VCC operation and to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. It has the capability to provide a TTL interface to a 5-V system environment.

This device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer and provide inverting outputs and symmetrical active-low output-enable (OE)\ inputs.

The outputs, which are designed to source or sink up to 12 mA, include equivalent 22- series resistors to reduce overshoot and undershoot.

When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down

	SN74LVTH162240-EP
Voltage Nodes (V)	3.3, 2.7
Vcc range (V)	2.7 to 3.6
Input Level	TTL/CMOS
Output Level	LVTTL
No. of Outputs	16
Output Drive (mA)	-12/12
tpd max (ns)	4
Static Current	5
Logic	Inverting
Technology Family	LVT
Rating	HiRel Enhanced Product
Pin/Package	48TSSOP

SN74LVTH162240-EP 特性

Controlled Baseline
- One Assembly/Test Site, One Fabrication Site
Enhanced Diminishing Manufacturing Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree
Member of the Texas Instruments Widebus™ Family
State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static-Power Dissipation
Output Ports Have Equivalent 22- Series Resistors, So No External Resistors Are Required
Supports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
Supports Unregulated Battery Operation Down To 2.7 V
Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
Ioff and Power-Up 3-State Support Hot Insertion
Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
Distributed VCC and GND Pins Minimize High-Speed Switching Noise
Flow-Through Architecture Optimizes PCB Layout
Latch-Up Performance Exceeds 250 mA Per JESD 17
ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)

SN74LVTH162240-EP 芯片订购指南

器件	状态	温度	价格（美元）	封装 \| 引脚	封装数量 \| 封装载体	丝印标记
CLVTH162240IDGGREP	ACTIVE	-40 to 85	0.90 \| 1ku	TSSOP (DGG) \| 48	2000 \| LARGE T&R
V62/04707-01XE	ACTIVE	-40 to 85	0.90 \| 1ku	TSSOP (DGG) \| 48	2000 \| LARGE T&R

SN74LVTH162240-EP 应用手册

标题	类型	大小
选择合适的德州仪器 (TI) 信号开关	PDF	1091
Shelf-Life Evaluation of Lead-Free Component Finishes	PDF	1310
Understanding and Interpreting Standard-Logic Data Sheets	PDF	857
TI IBIS File Creation, Validation, and Distribution Processes	PDF	380
Implications of Slow or Floating CMOS Inputs	PDF	101
CMOS Power Consumption and CPD Calculation	PDF	89
Designing With Logic	PDF	186
Live Insertion	PDF	150
Input and Output Characteristics of Digital Integrated Circuits	PDF	1708
SN54/74HCT CMOS Logic Family Applications and Restrictions	PDF	102
Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc	PDF	43

SN74LVTH162240-EP 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
CLVTH162240IDGGREP	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	CLVTH162240IDGGREP	CLVTH162240IDGGREP
V62/04707-01XE	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	V62/04707-01XE	V62/04707-01XE