SN74S09 具有集电极开路输出的双路 2 输入正与门

These devices contain four independent 2-input AND gates. The open-collector outputs require pull-up resistors to perform correctly. They may be connected to other open-collector outputs to implement active-low wired-OR or active-high wired-AND functions. Open-collector devices are often used to generate higher VOH levels.

The SN5409, SN54LS09, and SN54S09 are characterized for operation over the full military temperature range of -55°C to 125°C, The SN7409, SN74LS09, and SN74S09 are characterized for operation from 0°C to 70°C

SN74S09
Rating Catalog  
Technology Family S
SN74S09 特性
SN74S09 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN74S09D ACTIVE -40 to 85 0.24 | 1ku SOIC (D) | 14 50 | TUBE  
SN74S09DE4 ACTIVE -40 to 85 0.24 | 1ku SOIC (D) | 14 50 | TUBE  
SN74S09DG4 ACTIVE -40 to 85 0.24 | 1ku SOIC (D) | 14 50 | TUBE  
SN74S09DR ACTIVE -40 to 85 0.20 | 1ku SOIC (D) | 14 2500 | LARGE T&R  
SN74S09DRE4 ACTIVE -40 to 85 0.20 | 1ku SOIC (D) | 14 2500 | LARGE T&R  
SN74S09DRG4 ACTIVE -40 to 85 0.20 | 1ku SOIC (D) | 14 2500 | LARGE T&R  
SN74S09N ACTIVE -40 to 85 0.22 | 1ku PDIP (N) | 14 25 | TUBE  
SN74S09NE4 ACTIVE -40 to 85 0.22 | 1ku PDIP (N) | 14 25 | TUBE  
SN74S09 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN74S09D Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74S09D SN74S09D
SN74S09DE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74S09DE4 SN74S09DE4
SN74S09DG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74S09DG4 SN74S09DG4
SN74S09DR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74S09DR SN74S09DR
SN74S09DRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74S09DRE4 SN74S09DRE4
SN74S09N Pb-Free (RoHS)  CU NIPDAU  N/A for Pkg Type SN74S09N SN74S09N
SN74S09NE4 Pb-Free (RoHS)  CU NIPDAU  N/A for Pkg Type SN74S09NE4 SN74S09NE4
SN74S09 应用技术支持与电子电路设计开发资源下载
  1. SN74S09 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器门电路产品选型与价格 . xls
  3. Logic Guide 2009 (PDF 4263 KB)
  4. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  9. Designing With Logic (PDF 186 KB)
  10. Live Insertion (PDF 150 KB)
  11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  14. LOGIC Pocket Data Book (PDF 6001 KB)
  15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  16. Logic Cross-Reference (PDF 2938 KB)