BUF602 高速闭环缓冲器
The BUF602 is a closed-loop buffer recommended for a wide range of applications. Its wide bandwidth (1000MHz) and high slew rate (8000V/µs) make it ideal for buffering very high-frequency signals. For AC-coupled applications, an optional mid-point reference (VREF) is provided, reducing the number of external components required and the necessary supply current to provide that reference.
The BUF602 is available in a standard SO-8 surface-mount package and in an SOT23-5 where a smaller footprint is needed
|
BUF602 |
Iq per channel (Max) (mA) |
5.8 |
Slew Rate (Typ) (V/us) |
8000 |
GBW (Typ) (MHz) |
1200 |
Io (Typ) (mA) |
60 |
Vs (Min) (V) |
2.8 |
Vs (Max) (V) |
12.6 |
Number of Channels |
1 |
Pin/Package |
5SOT-23, 8SOIC |
Acl, min stable gain (V/V) |
1 |
BW @ Acl (MHz) |
1200 |
Vio (Max) (mV) |
30 |
Available Channels |
S |
Vn at Flatband (Typ) (nV/rtHz) |
4.8 |
Approx. Price (US$) |
0.85 | 1ku |
Iib (Max) (nA) |
7 |
Operating Temperature Range (C) |
-45 to 85 |
Rating |
Catalog |
BUF602 特性
- Wide Bandwidth: 1000MHz
- High Slew Rate: 8000V/µs
- Flexible Supply Range:
±1.4V to ±6.3V Dual Supplies
+2.8V to +12.6V Single Supply
- Output Current: 60mA (continuous)
- Peak Output Current: 350mA
- Low Quiescent Current: 5.8mA
- Standard Buffer Pinout
- Optional Mid-Supply Reference Buffer
- APPLICATIONS
- Low Impedance Reference Buffers
- Clock Distribution Circuits
- Video/Broadcast Equipment
- Communications Equipment
- High-Speed Data Acquisition
- Test Equipment and Instrumentation
BUF602 芯片订购指南
器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
BUF602ID |
ACTIVE |
-45 to 85 |
1.00 | 1ku |
SOIC (D) | 8 |
75 | TUBE |
|
BUF602IDBVR |
ACTIVE |
-45 to 85 |
0.85 | 1ku |
SOT-23 (DBV) | 5 |
3000 | LARGE T&R |
|
BUF602IDBVRG4 |
ACTIVE |
-45 to 85 |
0.85 | 1ku |
SOT-23 (DBV) | 5 |
3000 | LARGE T&R |
|
BUF602IDBVT |
ACTIVE |
-45 to 85 |
1.00 | 1ku |
SOT-23 (DBV) | 5 |
250 | SMALL T&R |
|
BUF602IDBVTG4 |
ACTIVE |
-45 to 85 |
1.00 | 1ku |
SOT-23 (DBV) | 5 |
250 | SMALL T&R |
|
BUF602IDG4 |
ACTIVE |
-45 to 85 |
1.00 | 1ku |
SOIC (D) | 8 |
75 | TUBE |
|
BUF602IDR |
ACTIVE |
-45 to 85 |
0.85 | 1ku |
SOIC (D) | 8 |
2500 | LARGE T&R |
|
BUF602IDRG4 |
ACTIVE |
-45 to 85 |
0.85 | 1ku |
SOIC (D) | 8 |
2500 | LARGE T&R |
|
BUF602 质量与无铅数据
器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
BUF602ID |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
BUF602ID |
BUF602ID |
BUF602IDBVR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
BUF602IDBVR |
BUF602IDBVR |
BUF602IDBVRG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
BUF602IDBVRG4 |
BUF602IDBVRG4 |
BUF602IDBVT |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
BUF602IDBVT |
BUF602IDBVT |
BUF602IDBVTG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
BUF602IDBVTG4 |
BUF602IDBVTG4 |
BUF602IDG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
BUF602IDG4 |
BUF602IDG4 |
BUF602IDR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
BUF602IDR |
BUF602IDR |
BUF602IDRG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
BUF602IDRG4 |
BUF602IDRG4 |
BUF602 应用技术支持与电子电路设计开发资源下载
- BUF602 数据资料 dataSheet 下载.PDF
- TI 德州仪器视频功能产品选型与价格 . xls
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BUF602 工具与软件
培训内容 |
型号 |
软件/工具类型 |
BUF602 评估模块 |
BUF602EVM |
开发电路板/EVM |