TMP302C 采用 SOT563 封装的低功耗、1.4V 温度开关

The TMP302x is a temperature switch in a micropackage (SOT563). The TMP302x offers low power (15µA max) and ease-of-use through pin-selectable trip points and hysteresis.

These devices require no additional components for operation; they can function independent of microprocessors or microcontrollers.

The TMP302x is available in several different versions. For additional trip points, contact a TI representative

TMP302A TMP302B TMP302C TMP302D
# Comparators 1     1     1     1    
Output Type Open Drain     Open Drain     Open Drain     Open Drain    
SetPoint Type 50, 55, 60, 65     70, 75, 80, 85     90, 95, 100, 105     110, 115, 120, 125    
SetPoint Value (deg C) 50-65 (in 5 degree increments)     70-85 (in 5 degree increments)     90-105 (in 5 degree increments)     110-125 (in 5 degree increments)    
Accuracy Over Temp Range (Max) (C) 2.0     2.0     2.0     2.0    
Supply Voltage (Min) (V) 1.4     1.4     1.4     1.4    
Supply Voltage (Max) (V) 3.6     3.6     3.6     3.6    
Iq (Typ) (uA) 8     8     8     8    
Operating Temperature Range (C) -40 to 125     -40 to 125     -40 to 125     -40 to 125    
Pin/Package 6SOT     6SOT     6SOT     6SOT    
Approx. Price (US$) 0.20 | 1ku     0.20 | 1ku     0.20 | 1ku     0.20 | 1ku    
Rating Catalog     Catalog     Catalog     Catalog
TMP302C 特性
TMP302C 芯片订购指南
器件 状态 温度 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
TMP302CDRLR ACTIVE -40 to 125 0.20 | 1ku SOT (DRL) | 6 4000 | LARGE T&R  
TMP302CDRLT ACTIVE -40 to 125 0.23 | 1ku SOT (DRL) | 6 250 | SMALL T&R  
TMP302C 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TMP302CDRLR Green (RoHS & no Sb/Br)   CU NIPDAU   Level-1-260C-UNLIM TMP302CDRLR TMP302CDRLR
TMP302CDRLT Green (RoHS & no Sb/Br)   CU NIPDAU   Level-1-260C-UNLIM TMP302CDRLT TMP302CDRLT
TMP302C 应用技术支持与电子电路设计开发资源下载
  1. TMP302C 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器温度开关产品选型与价格