TMS570LS20206-PGE ARM Cortex-R4F 闪存微处理器
The TMS570LS series is a high performance automotive grade microcontroller family which has been certified for use in IEC 61508 SIL3 safety systems. The safety architecture includes Dual CPUs in lockstep, CPU and Memory Built-In Self Test (BIST) logic, ECC on both the Flash and the data SRAM, parity on peripheral memories, and loop back capability on peripheral IOs.
The TMS570LS family integrates the ARM® Cortex™-R4F Floating Point CPU which offers an efficient 1.6 DMIPS/MHz, and has configurations which can run up to 160 MHz providing more than 250 DMIPS. The TMS570LS series also provides different Flash (1MB or 2MB) and data SRAM (128KB or 160KB) options with single bit error correction and double bit error detection
|
TMS570LS20206-PGE |
TMS570LS20206-ZWT |
| CPU |
ARM-Cortex - R4F |
ARM-Cortex - R4F |
| Frequency (MHz) |
140 |
160 |
| Flash (KB) |
2048 |
2048 |
| RAM (KB) |
160 |
160 |
| CAN |
2 |
3 |
| MibSPI |
3 |
3 |
| SCI/LIN |
2 |
2 |
| HET Channels |
25 |
32 |
| ADC |
2 x 12-Bit (20ch) |
2 x 12-Bit (24ch) |
| GPIO |
68 |
115 |
| EMIF |
|
16-bit |
| ETM (Trace) |
|
32-bit |
| RTP (Trace) |
|
16-bit |
| DMM (Calibration) |
|
16-bit |
| Core Supply (Volts) |
1.5 |
1.5 |
| IO Supply (V) |
3.3 |
3.3 |
| Pin/Package |
144LQFP |
337NFBGA |
| Approx. Price (US$) |
16.60 | 1ku |
|
TMS570LS20206-PGE 特性
- High-Performance Automotive Grade Microcontroller for Safety Critical Applications
- Certified for use in SIL3 Applications
- Dual CPUs running in Lockstep
- ECC on Flash and SRAM
- CPU and Memory BIST (Built-In Self Test)
- Error Signaling Module (ESM) w/ Error Pin
- ARM® Cortex™-R4F 32-Bit RISC CPU
- Efficient 1.6 DMIPS/MHz with 8-stage pipeline
- Floating Point Unit with Single/Double Precision
- Memory Protection Unit (MPU)
- Open Architecture With Third-Party Support
- Operating Features
- Up to 160-MHz System Clock
- Core Supply Voltage (VCC): 1.5 V
- I/O Supply Voltage (VCCIO): 3.3 V
- Integrated Memory
- 1M-Byte or 2M-Byte Flash with ECC
- 128K-Byte or 160K-Byte RAM with ECC
- Multiple Communication interfaces including FlexRay, CAN, and LIN
- NHET Timer and 2x 12-bit ADCs
TMS570LS20206-PGE 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| S5LS20206ASPGEQQ1 |
ACTIVE |
|
14.95 | 1ku |
LQFP (PGE) | 144 |
1 |
|
TMS570LS20206-PGE 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| S5LS20206ASPGEQQ1 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
S5LS20206ASPGEQQ1 |
S5LS20206ASPGEQQ1 |
TMS570LS20206-PGE 应用技术支持与电子电路设计开发资源下载
- TMS570LS20206-PGE 数据资料 dataSheet 下载.PDF
- TI 德州仪器Hercules™ ARM®安全微处理器选型与价格 . xls
- OMAP-L13x/AM1x Linux PSP Overview
- ARM Assembly Language Tools v4.7 User's Guide
- ARM Optimizing C/C++ Compiler v4.7 User's Guide
- Power Management for AM18xx/AM17xx Processors
- ARM Portfolio Technical Overview Brochure
- Software and Hardware Design Challenges due to Dynamic Raw NAND Market
- Programmable Real-Time Unit (PRU): Extending Functionality Of Existing SoCs
TMS570LS20206-PGE 工具与软件
